Thermal Systems Integration Engineer, Advanced Packaging
Boston Materials produces advanced materials with enhanced energy transfer properties using its patented Z-axis Carbon Fiber technology. The Company's products solve critical performance bottlenecks in applications spanning thermal, electrical, and structural use cases. Its breakthrough Liquid Metal ZRT thermal interface material is designed for the most demanding AI Infrastructure. Boston Materials is committed to expanding high-volume manufacturing in the United States. For more information, visit https : / / www.bomaterials.com /
ABOUT THE OPPORTUNITY
Not often in ones career do we get the chance to
Get close to the mission. Getting a real sense of what the business does and how our work directly affects the outcome. Where everyone is involved with the companys success. No layers, no silos, no bureaucracy. Just the opportunity to make the greatest impact with the most responsibility.
Move faster. Adapting to changes in the market at record speed. No multi-layer signoffs and approvals. Instead, the latitude needed to get a new idea, product, or process off the ground quickly. Where we can experiment and test new ideas and are encouraged to do so. We create solutions to problems that our customers truly care about, and we understand that customers wont wait for us to figure them out.
Branch beyond the role. Were not defined by past experiences or confined by our current job description. Every day offers opportunities to have influence and be challenged with new projects and tasks. Working shoulder-to-shoulder with some of the top talent in the industry, were able to showcase our talents, expand our knowledge, develop new skills, and take ownership and act. All while contributing to the overall success of the organization.
Create critical solutions. Join us to solve the most critical challenges facing the Advanced Semiconductor, AI Infrastructure, and Advanced Materials industries.
Opportunity knocks at Boston Materials. Will you answer the call?
Solve one of the most critical challenges facing the Semiconductor and Electronics Industry thermal management! Join the Boston Materials team to help unlock the full potential of Z-axis Fiber technology and pave the way for groundbreaking advancements powering AI.
The Role
We are seeking a highly motivated Applications Engineer to serve as the primary technical partner for our customers as they evaluate and adopt our high-performance thermal interface material (TIM) products. This role is ideal for an engineer who thrives at the intersection of customer engagement, problem-solving, and product performance validation. You will be responsible for leading early- to mid-stage customer interactions, capturing and translating requirements into actionable technical work, and ensuring that customers have the data, samples, and support they need to successfully integrate and qualify our TIM in their advanced semiconductor packaging applications. This position offers the opportunity to work closely with hyperscalers, ODMs, and OSATs, and to influence the adoption of cutting-edge thermal solutions in next-generation AI and data center systems.
Your Responsibilities
Your Skills and Expertise
Summary of Benefits
Boston Materials is an EOE and at the forefront of materials innovation, the key to which is diverse teams with unique backgrounds and experiences. We are committed to employing a diverse workforce with equal employment opportunities regardless of race, color, religion, sex, national origin, age, sexual orientation, gender identity, gender expression, marital status, veteran status, or disability.
Applicants must be currently authorized to work in the US on a full-time basis.
$120,000 - $170,000 a year
Compensation details : 120000-170000 Yearly Salary
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Packaging Engineer • Billerica, Massachusetts, United States, 01821