Package Design Engineer

Requirements / Skills :

• Possess Mentor Graphics Cadence PLA knowledge
• Multiple layers package design (8) experience
• Understanding of substrate manufacturing design rule and assembly rule
• Possess Flip Chip Package Design Concept
• Good communication skill.
• May require vendor on-site support

Key Skills

Load & Unload,Ruby,Shipping & Receiving,Forklift,Lift Truck Experience,Basic Math,Packaging,Warehouse Experience,Delivery Driver Experience,Heavy Lifting,Human Resources,RF Scanner

Employment Type : Full Time

Experience : years

Vacancy : 1