Principal Application Engineer, Advanced Packaging Materials

Principal Application Engineer, Advanced Packaging Materials

Irvine, California, United States

$125,000 to $150,000 + Bonus + Full Benefits + Paid Relocation

Overview

This role is for a Principal Application Engineer to join a global organization focused on innovation and cutting-edge material technologies within the Semiconductor Packaging or Adhesive Technologies space, specifically supporting the electronics market. The position involves providing high-level technical engineering support, developing in-depth application expertise, and directly engaging with key customers.

Key Responsibilities

• Technical Leadership : Serve as the technical lead on developmental and commercialized products by optimizing material application processes.
• Customer Interaction : Directly interact with customers to troubleshoot and solve product and process-related problems.
• Value Creation : Ensure that new and existing products can be successfully employed by customers in a manner that brings clear and identifiable value.
• Problem Solving : Solve technology-specific fundamental problems associated with entire product lines and / or product classes using novel approaches to application process development, troubleshooting, and material characterization.
• Travel : Traveling of up to 10% will be part of this role.

What Makes You a Good Fit (Required Qualifications)

Good understanding of the latest Semiconductor Packaging trends , especially 2.5D and 3D package .