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Wire Bonding Specialist
Wire Bonding SpecialistLawrence Berkeley National Laboratory • Berkeley, CA, United States
No longer accepting applications
Wire Bonding Specialist

Wire Bonding Specialist

Lawrence Berkeley National Laboratory • Berkeley, CA, United States
2 days ago
Job type
  • Full-time
Job description

Berkeley Lab is hiring a Wire Bonding Specialist to support precision microelectronics assembly. This role is key to fabricating advanced electronic systems for scientific detectors, sensors, and instrumentation. You'll perform precision wire bonding on hybrid microcircuits, semiconductors, and microelectronic devices, collaborating with engineers and scientists in cleanroom and lab environments. The position supports both R&D and production projects-an exciting chance to contribute to world-class scientific research.

What You Will Do :

  • Operate and maintain gold and aluminum wire bonders.
  • Perform wedge and ball bonding on hybrid modules, power boards, and sensors.
  • Set up and optimize bonding parameters for various materials and applications.
  • Ensure alignment and bond integrity per engineering specs.
  • Conduct visual and metrology inspections under a microscope.
  • Verify bond quality using mechanical pull / shear tests.
  • Troubleshoot bonding defects and implement corrective actions.
  • Report on production status, yield, and quality metrics.
  • Follow detailed drawings, schematics, and documentation for precise assembly.
  • Support prototype and production assembly of microelectronic devices.
  • Maintain accurate records and support process improvements.
  • Collaborate with engineers, scientists, and technologists on integration and testing.

What is Required :

Wire Bonding Specialist Level 3 :

  • 4-6 years of wire bonding experience or equivalent education / experience.
  • Proficient with manual / automated wire bonders (e.g., West-Bond, K&S, Hesse).
  • Skilled in wedge and ball bonding techniques and inspection methods.
  • Experienced in visual / mechanical inspection using microscopes and test tools (pull / shear testers).
  • Able to interpret engineering drawings, bond diagrams, and assembly docs.
  • Strong hand-eye coordination and attention to detail for microscope work.
  • Familiar with cleanroom environments and Electrostatic Discharge (ESD) safe practices.
  • Solid understanding of electronics fabrication and quality standards.
  • Proficient with trade tools, measurements, and basic calculations.
  • Can read schematics, sketches, and component layouts.
  • Color vision adequate for identifying wiring and safety indicators.
  • Physically able to climb stairs and lift up to 50 lbs (23 kg).
  • Good communication skills; able to work independently or on a team.
  • In Addition, Wire Bonding Specialist Level 4 :

  • 6+ years of wire bonding experience or equivalent education / experience.
  • Desired Qualifications :

    Wire Bonding Specialist Level 3 :

  • Experience with Hesse BJ815, BJ820, and BJ855 wire bonders is a plus.
  • Knowledge of ESD protocols and cleanroom procedures.
  • Comfortable working under a microscope for extended periods.
  • Associate degree, trade school, or equivalent training in wire bonding required.
  • Familiar with electronics documentation and basic PC applications (Google Workspace, databases, MS Office).
  • Python scripting is a plus.
  • In Addition, Wire Bonding Specialist Level 4 :

  • Skilled in developing technical procedures and training materials.
  • Notes :

  • This is a full-time career appointment, non-exempt (hourly paid) from overtime pay.
  • This position is represented by a union for collective bargaining purposes.
  • Salary will be determined based on range by collective bargaining agreement.
  • The hourly range for the Wire Bonding Specialist Level 3 position is $41.77 - $60.55. The hourly rate for this position will be commensurate with the final candidate's qualifications and experience, including skills, knowledge, relevant education, certifications, plus also aligned with the internal peer group.
  • The hourly range for the Wire Bonding Specialist Level 4 position is $48.02 - $69.63. The hourly rate for this position will be commensurate with the final candidate's qualifications and experience, including skills, knowledge, relevant education, certifications, plus also aligned with the internal peer group.
  • This position is subject to a background check. Any convictions will be evaluated to determine if they directly relate to the responsibilities and requirements of the position. Having a conviction history will not automatically disqualify an applicant from being considered for employment.
  • Work will be primarily performed at : Lawrence Berkeley National Lab, 1 Cyclotron Road, Berkeley, CA.
  • Want to learn more about working at Berkeley Lab? Please visit : careers.lbl.gov

    Equal Employment Opportunity Employer : The foundation of Berkeley Lab is our Stewardship Values : Team Science, Service, Trust, Innovation, and Respect; and we strive to build community with these shared values and commitments. Berkeley Lab is an Equal Opportunity Employer. We heartily welcome applications from all who could contribute to the Lab's mission of leading scientific discovery, excellence, and professionalism. In support of our rich global community, all qualified applicants will be considered for employment without regard to race, color, religion, sex, sexual orientation, gender identity, national origin, disability, age, protected veteran status, or other protected categories under State and Federal law.

    Berkeley Lab is a University of California employer. It is the policy of the University of California to undertake affirmative action and anti-discrimination efforts, consistent with its obligations as a Federal and State contractor.

    Misconduct Disclosure Requirement : As a condition of employment, the finalist will be required to disclose if they are subject to any final administrative or judicial decisions within the last seven years determining that they committed any misconduct, are currently being investigated for misconduct, left a position during an investigation for alleged misconduct, or have filed an appeal with a previous employer.

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