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Entry level mechanical engineering Jobs in Lowell, MA
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Entry level mechanical engineering • lowell ma
Mechanical Engineering, Principal
MACOMLowell, MA, US- Promoted
Mechanical Engineer
Butler America Aerospace LLCChelmsford, MA, United States- Promoted
Electro-Mechanical Assembler
TransMedicsAndover, MA, United States- Promoted
Mechanical Engineering, Principal
Macom Technology Solutions Holdings, Inc.Lowell, MA, United States- Promoted
Diesel Technician Mechanic III Entry Level
Penske Truck Leasing Co., L.P.Lawrence, MA, US- Promoted
Mechanical Engineer
Butler AmericaChelmsford, MA, United States- Promoted
Mechanical Engineer
DonatechChelmsford, MA, United StatesMechanical Product Engineering Intern
MACOMLowell, MA, US- Promoted
Mechanical Inspector - Onsite
RTXWestford, MA, United States- Promoted
Border Patrol Agent (BPA) - Entry Level
U.S. Customs and Border ProtectionPelham, New Hampshire- Promoted
Faculty Part-time - Mechanical Engineering
InsideHigherEdLowell, Massachusetts, United StatesFaculty Part-time - Mechanical Engineering
UMass LowellLowell, Massachusetts, United States- Promoted
Entry Level Sandblaster
HW Staffing SolutionsLawrence, MA, United StatesTechnician - entry level
Frontrunner BusBillerica, MA, USMechanical Engineer
The Structures Company, LLCAndover, MA, United States- Promoted
Mechanical Engineer
The Judge GroupChelmsford, MA, United States- Promoted
Mechanical Engineer
Chipton-RossChelmsford, MA, United StatesMechanical Engineer
Triton Systems, Inc.Chelmsford, MA, USAEntry Level Communications Coordinator
Style NetboxLawrence, MA, US- government (from $ 69,241 to $ 368,310 year)
- cyber security (from $ 124,959 to $ 250,000 year)
- software architect (from $ 125,000 to $ 234,000 year)
- dentist (from $ 79,875 to $ 225,000 year)
- general dentist (from $ 79,875 to $ 225,000 year)
- hospital (from $ 30,000 to $ 215,500 year)
- software engineering manager (from $ 87,360 to $ 215,400 year)
- Los Angeles, CA (from $ 142,500 to $ 147,100 year)
- New Orleans, LA (from $ 44,850 to $ 147,100 year)
- New York, NY (from $ 44,850 to $ 147,100 year)
- Garden Grove, CA (from $ 28,000 to $ 70,000 year)
- Elk Grove, CA (from $ 28,000 to $ 70,000 year)
- San Francisco, CA (from $ 56,250 to $ 60,000 year)
- St Petersburg, FL (from $ 45,000 to $ 50,000 year)
- St Louis, MO (from $ 28,000 to $ 48,750 year)
- Jersey City, NJ (from $ 43,875 to $ 48,750 year)
The average salary range is between $ 45,000 and $ 147,100 year , with the average salary hovering around $ 77,000 year .
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Mechanical Engineering, Principal
MACOMLowell, MA, US- Permanent
Mechanical Engineering, Principal
Job Description:
Support new package design and development by working with ateam of engineers and designers. Responsible for all mechanical aspects of new and legacy designs. Devices range from single chip packages to subsystem modules.
Key aspects of the role include:
- Ownership of the compliance of designs to meet mechanical requirements
- Interaction with customers and ability to negotiate requirements where conflicts may occur
- Interaction with internal design engineers, project managers, assembly and test entities to ensure all aspects of the design are in-line with expectations across the company
- Mechanical analyses including but not limited to structural, thermal and reliability
- Ownership and design of assembly and test fixtures
- Understanding of machining best practice and GD&T tolerancing
- Ability to work with vendors to understand their capabilities in aligning part designs with industry capabilities
- Understanding of various manufacturing techniques including subtractive metal fabrication, additive manufacturing, etching, laser cutting, welding and marking, etc.
- Ability to work in fast paced environment with small and large teams with little-to-no supervision
Qualifications:
Mechanical Engineering Degree or similar with 8+ years of experience in an electronics packaging role. Experience with IC packaging, system and subsystem mechanical design and analysis. The ideal candidate will have experience with RF and millimeter wave types of products.
Key capabilities of an ideal candidate are:
- Experience with packaging for RF-Power applications, using eutectic and/or sintered epoxy die attach
- Experience with aluminum, copper and other alloys for use in packaging and thermal transfer
- Understanding and awareness of coefficient of thermal expansion (CTE) matching between various mediums
- Understanding of metal plating standards and requirements
- Experience in reliability, failure analysis, and quality assurance in advanced package and process development
- Experience designing for manufacturing, both internally and externally, both piece-part and assemblies
- Knowledge of product characterization, testing, quality and reliability, including compliance testing and certification is a plus [MIL-PRF-38534, JEDEC, IPC, etc.]
- Intimate knowledge of structural analysis using 3D CAD tools as well as first principles
- Intimate knowledge of thermal analysis using 3D CAD tools as well as first principles
- Demonstrated ability to lead independent process development
- Ability to provide suppliers direction by working with design, assembly, and quality organizations
- Familiar with finite element analyses (FEA) required and computational fluid dynamics (CFD) desired
- Familiar solving steady state and dynamic thermal problems
- Experience using: Solidworks, AutoCad, and PCB layout viewers is ideal
- Strong problem solving skills along with good communication, team work, and interpersonal skills
- Experience in critical thinking and presentation skills
- Experience with supplier and program management roles
- Experience working in complex teams to understand and balance all aspects of a design to meet desired outcomes
- Ability to balance and prioritize multiple programs and needs simultaneously
- Fluent communicator in the English language
Due to ITAR regulations, only candidates who are U.S. Persons (U.S. citizens, U.S. nationals, lawful permanent residents, or individuals granted asylum or refugee status) will be considered for this position.