Technical artist Jobs in Orange, CA

Description

Technical Director – Package Technology Development

Highly visible role that will lead the development of advanced heterogeneous RF packaging technologies that integrate RF, analog, and digital functions into compact, high-performance modules. You will define package architectures and baseline assembly processes optimized for RF performance, thermal management, reliability, yield, and cost across Skyworks’ mobile, automotive, IoT, and infrastructure product portfolios and the ability to lead cross-functional teams while managing relationships with substrate suppliers, OSATs, foundries and internal factory partners

Responsibilities

Principal Duties & Responsibilities

• Lead development of advanced RF packaging technologies from architecture definition through high-volume manufacturing, integrating multiple die technologies (GaAs, GaN, SOI, SiGe, CMOS) into system-in-package solutions
• Develop and optimize RF-specific packaging capabilities and performance.
• Hands on application of multiple assembly technologies: flip-chip, fan-out, wafer-level packaging, die stacking, and hybrid bonding as appropriate for RF applications.
• Develop compelling packaging roadmap that delivers next generation that is ahead of the competition.
• Lead cross-functional development teams spanning RF design, signal integrity, thermal engineering, product engineering, reliability, quality, and operations.

Required Experience and Skills

Qualifications

• MS or PhD electrical, Mechanical, Materials Engineering, or Physics, with +5yrs of leadership experience in leading advanced packaging technology development, new product introduction, and high-volume manufacturing. RF packaging expertise is a plus.
• Proven experience with multiple packaging platforms: LGA, system-in-package (SiP), cavity packages, air-cavity designs, overmolded modules, and fan-out packaging applied to RF applications
• Zero defect mindset from new technology development to high volume release
• Strong background in statistical tools, DFMEA/PFMEA, DFM
• Demonstrated track record - managing complex new technology programs with aggressive schedules, cost optimized and on-time delivery to the customer.
• Excellent communication skills, ability to translate vision to tangible actions, executive level communication, strong influence to internal and external stakeholders.
• Understanding of automotive (AEC-Q100/Q200), HiRel and telecommunications reliability standards, and various failure analysis techniques.
• Experience and dominate advance interconnections as TSV, micro bumps, hybrid bonding .
• Knowledge in new product introduction and process transfer from design to mass production Understanding APQP and PPAP standards.

• Up to 25% domestic and international travel to supplier and development facilities​​​​​​​​​​​​​​​​.

Desired Experience and Skills