Head of Platform Mechanical & Thermal Engineering

Overview

Head of Platform Mechanical & Thermal Engineering

Lead all aspects of mechanical architecture, advanced cooling, and CAD infrastructure for next-generation high-power density ASIC systems. Build and scale the mechanical and thermal engineering organization with a strong focus on liquid cooling technologies and rack-level thermal management.

Key Responsibilities

• Leadership & Team Growth

Build, mentor, and scale a team of mechanical and thermal engineers.

Own the design of server enclosures, modules, and racks optimized for high-power ASICs.

Deploy and optimize Siemens NX for CAD / PLM workflows, with integrated libraries and release processes.

Define test plans for thermal performance, fluid integrity, and long-term reliability of liquid cooling systems.

Collaborate with silicon, electrical, and system engineers to co-optimize cooling with power delivery.

Candidate Profile

Base Salary & Benefits

About Etched

Etched is building AI chips that are hard-coded for individual model architectures. Our first product (Sohu) supports transformers and offers higher throughput and lower latency than a B200. With Etched ASICs, you can build products that would be difficult with GPUs, such as real-time video generation models and deeply parallel reasoning agents.

Other

We are a fully in-person team in San Jose (Santana Row) and value engineering skills. We expect technical staff to contribute to both engineering and research as needed. This role may include collaboration with suppliers, ODMs, and datacenter partners, and requires representation in executive reviews.

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