DCP Equipment Engineering Intern Summer 2026

Job Summary :

• Summer Engineering internship at NXPs ATMC wafer manufacturing facility
• Approximately 12 weeks long
• Learn the basics of semiconductor manufacturing technology and operations
• Work with an experienced engineer mentor to troubleshoot production equipment and process issues within the factory
• Drive one or more real projects urgently needed by the fab related to key business metrics (Safety Quality Delivery Cost)
• Deliver real results to the business and present to factory senior management at the end of the internship
• Equipment engineering will optimize the multi-million dollar production equipment (parts preventative maintenance cleaning and repair etc.)
• Process engineering will optimize the processes (materials time temperature dose etc.) of the various manufacturing steps

Key Challenges :

Cross functional aspects :

Job Qualifications :

More information about NXP in the United States...

NXP is an Equal Opportunity / Affirmative Action Employer regardless of age color national origin race religion creed gender sex sexual orientation gender identity and / or expression marital status status as a disabled veteran and / or veteran of the Vietnam Era or any other characteristic protected by federal state or local addition NXP will provide reasonable accommodations for otherwise qualified disabled individuals.

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Required Experience :

Intern

Key Skills

Microsoft Office,Public Relations,Google Docs,Data Collection,MailChimp,Microsoft Word,Dermal Fillers,Microsoft Powerpoint,Research Experience,Microsoft Excel,Adobe Photoshop,Writing Skills

Employment Type : Full-Time

Experience : years

Vacancy : 1