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Thermal Mechanical Engineer - Icepak/CFD
Thermal Mechanical Engineer - Icepak/CFDAdvanced Micro Devices, Inc • Secaucus, New Jersey, United States
Thermal Mechanical Engineer - Icepak/CFD

Thermal Mechanical Engineer - Icepak/CFD

Advanced Micro Devices, Inc • Secaucus, New Jersey, United States
30+ days ago
Job type
  • Full-time
Job description

WHAT YOU DO AT AMD CHANGES EVERYTHING At AMD, our mission is to build great products that accelerate next-generation computing experiences—from AI and data centers, to PCs, gaming and embedded systems. Grounded in a culture of innovation and collaboration, we believe real progress comes from bold ideas, human ingenuity and a shared passion to create something extraordinary. When you join AMD, you’ll discover the real differentiator is our culture. We push the limits of innovation to solve the world’s most important challenges—striving for execution excellence, while being direct, humble, collaborative, and inclusive of diverse perspectives. Join us as we shape the future of AI and beyond. Together, we advance your career. THE ROLE : As a Thermal Engineer in Data Center Platform Engineering Group (DPEG) Thermal Mechanical Engineering department, you will be responsible for the thermal design, validation and technology development for the AMD Data Center GPU products in this expanding and strategic market for AMD. To accomplish this, you will need to interact with other key engineering teams such as silicon design, boarding engineering, validation, and manufacturing and leaders within AMD, our customers, and our partners. THE PERSON : The Thermal Engineer on the Thermal Mechanical Engineering team will have excellent communication skills, planning skills, technical expertise, is a team player, possesses critical problem solving and troubleshooting skills, is a self-starter, and is well organized. They will be market savvy and comfortable in a fast-paced, multi-tasking environment. KEY RESPONSIBILITIES : The Thermal Engineer on the Thermal Mechanical Engineering team will be responsible for the end-to-end development and delivery of thermal and / or mechanical solutions for the GPU and associated platforms. The successful candidate will have a thermal and mechanical development background with silicon level or system level experience. They will integrate into a global development team in delivering commercially viable products (silicon to systems) to the marketplace in a timely and cost-effective manner. Some of the key responsibilities will include : Design thermal solutions to enable AMD's next generation of Datacenter GPUs Collaborate with silicon design engineering, board engineering, power engineering and other cross-functional teams to design thermal-mechanical solutions from chip level to system level Contribute to the overall product cycle from conceptualization through mass production Work in a dynamic and fast-paced product development environment Thermal validation of thermal-mechanical hardware at chip, card and system level Identify and investigate novel thermal technologies and work with vendors and internal teams to evaluate the technologies for alignment to the AMD product roadmap Drive process improvements while executing fast time-to-market on products. REQUIREMENTS : The selected candidate will use his / her proven technical skills to ensure the engineering team continuously innovates, uses ‘best practices’, and adds value for its customers. Key qualifications required include : · Strong background in heat transfer and fluid dynamics with emphasis on electronics thermal management. Thorough understanding of electronics cooling technologies; Air cooling and liquid cooling. · CFD - Experience with CFD for liquid cooled systems with Icepak or similar tools is required. CFD experience in ANSYS Icepak or AEDT is a plus. · CAD - Experience with SolidWorks and / or Creo is required. Ability to implement liquid cooling designs in Creo or SolidWorks for CFD analysis is a plus. · Deep understanding of thermal management design elements including TIM, spreaders, heat sink, vapor chamber, heat pipe, and fan · Rack level and Datacenter and server level design experience. · Experience developing liquid cooling solutions including design of cold plates, liquid interconnects, implementing quick disconnects, hoses, and manifolds. · Lab Skills : Experience with design of experiments, instrumentation, data acquisition, and data analysis, including uncertainty analysis, is a plus. · Programming Skills : Ability to write scripts in programming languages (e.g., Python, C / C++, MATLAB) for data analysis and tool development is a plus. · Excellent verbal and written communication skills at the engineering and executive levels, including a proven track record of working across organization boundaries to define requirements, solve complex problems and drive programs to successful completion ACADEMIC CREDENTIALS : MS, Mechanical Engineering, PhD preferred in Mechanical Engineering This role is not eligible for VISA sponsorship LOCATION : Secaucus, New Jersey #LI-BW1 Benefits offered are described : AMD benefits at a glance. AMD does not accept unsolicited resumes from headhunters, recruitment agencies, or fee-based recruitment services. AMD and its subsidiaries are equal opportunity, inclusive employers and will consider all applicants without regard to age, ancestry, color, marital status, medical condition, mental or physical disability, national origin, race, religion, political and / or third-party affiliation, sex, pregnancy, sexual orientation, gender identity, military or veteran status, or any other characteristic protected by law. We encourage applications from all qualified candidates and will accommodate applicants’ needs under the respective laws throughout all stages of the recruitment and selection process. AMD may use Artificial Intelligence to help screen, assess or select applicants for this position. AMD’s “Responsible AI Policy” is available here. This posting is for an existing vacancy.THE ROLE : As a Thermal Engineer in Data Center Platform Engineering Group (DPEG) Thermal Mechanical Engineering department, you will be responsible for the thermal design, validation and technology development for the AMD Data Center GPU products in this expanding and strategic market for AMD. To accomplish this, you will need to interact with other key engineering teams such as silicon design, boarding engineering, validation, and manufacturing and leaders within AMD, our customers, and our partners. THE PERSON : The Thermal Engineer on the Thermal Mechanical Engineering team will have excellent communication skills, planning skills, technical expertise, is a team player, possesses critical problem solving and troubleshooting skills, is a self-starter, and is well organized. They will be market savvy and comfortable in a fast-paced, multi-tasking environment. KEY RESPONSIBILITIES : The Thermal Engineer on the Thermal Mechanical Engineering team will be responsible for the end-to-end development and delivery of thermal and / or mechanical solutions for the GPU and associated platforms. The successful candidate will have a thermal and mechanical development background with silicon level or system level experience. They will integrate into a global development team in delivering commercially viable products (silicon to systems) to the marketplace in a timely and cost-effective manner. Some of the key responsibilities will include : Design thermal solutions to enable AMD's next generation of Datacenter GPUs Collaborate with silicon design engineering, board engineering, power engineering and other cross-functional teams to design thermal-mechanical solutions from chip level to system level Contribute to the overall product cycle from conceptualization through mass production Work in a dynamic and fast-paced product development environment Thermal validation of thermal-mechanical hardware at chip, card and system level Identify and investigate novel thermal technologies and work with vendors and internal teams to evaluate the technologies for alignment to the AMD product roadmap Drive process improvements while executing fast time-to-market on products. REQUIREMENTS : The selected candidate will use his / her proven technical skills to ensure the engineering team continuously innovates, uses ‘best practices’, and adds value for its customers. Key qualifications required include : · Strong background in heat transfer and fluid dynamics with emphasis on electronics thermal management. Thorough understanding of electronics cooling technologies; Air cooling and liquid cooling. · CFD - Experience with CFD for liquid cooled systems with Icepak or similar tools is required. CFD experience in ANSYS Icepak or AEDT is a plus. · CAD - Experience with SolidWorks and / or Creo is required. Ability to implement liquid cooling designs in Creo or SolidWorks for CFD analysis is a plus. · Deep understanding of thermal management design elements including TIM, spreaders, heat sink, vapor chamber, heat pipe, and fan · Rack level and Datacenter and server level design experience. · Experience developing liquid cooling solutions including design of cold plates, liquid interconnects, implementing quick disconnects, hoses, and manifolds. · Lab Skills : Experience with design of experiments, instrumentation, data acquisition, and data analysis, including uncertainty analysis, is a plus. · Programming Skills : Ability to write scripts in programming languages (e.g., Python, C / C++, MATLAB) for data analysis and tool development is a plus. · Excellent verbal and written communication skills at the engineering and executive levels, including a proven track record of working across organization boundaries to define requirements, solve complex problems and drive programs to successful completion ACADEMIC CREDENTIALS : MS, Mechanical Engineering, PhD preferred in Mechanical Engineering This role is not eligible for VISA sponsorship LOCATION : Secaucus, New Jersey #LI-BW1

Benefits offered are described : AMD benefits at a glance. AMD does not accept unsolicited resumes from headhunters, recruitment agencies, or fee-based recruitment services. AMD and its subsidiaries are equal opportunity, inclusive employers and will consider all applicants without regard to age, ancestry, color, marital status, medical condition, mental or physical disability, national origin, race, religion, political and / or third-party affiliation, sex, pregnancy, sexual orientation, gender identity, military or veteran status, or any other characteristic protected by law. We encourage applications from all qualified candidates and will accommodate applicants’ needs under the respective laws throughout all stages of the recruitment and selection process. AMD may use Artificial Intelligence to help screen, assess or select applicants for this position. AMD’s “Responsible AI Policy” is available here. This posting is for an existing vacancy.

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Thermal Mechanical Engineer IcepakCFD • Secaucus, New Jersey, United States

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