Electronics Package Design Engineer

Job Description

Job Description

Electronics Package Design Engineer

Primary Skills - package layout, signal integrity, flip chip, bga, ceramic, multi-chip modules, electronics packaging, system in package, cadence

Job Description

Electronics Packaging Design Engineer

We are seeking an experienced Electronics Packaging Design Engineer to join our team. In this role, you will lead the design of advanced packaging solutions including flip-chip BGA, ceramic packages, multi-chip modules (MCMs), and system-in-package (SiP) architectures. You’ll collaborate with cross-functional teams and suppliers to deliver reliable, manufacturable, and cost-effective designs.

Responsibilities :

• Design interconnects, substrate stack-ups, routing strategies, and package layouts.
• Verify designs against electrical, thermal, mechanical, and manufacturability requirements.
• Partner with suppliers and internal teams to align designs with process capabilities.
• Support failure analysis and root-cause investigations.
• Document design processes and lead reviews from concept to release.
• Mentor junior engineers and support packaging technology roadmaps.

Qualifications

Preferred : Experience with OSATs / foundries, high-speed digital interfaces (PCIe, DDR, SerDes), package-level simulation tools, and defense packaging for extreme environments.

Why is This a Great Opportunity

Well-established, stable company. Long-term projects featuring great technology. They are a great team of people to work with.

Employees work 5 days per week onsite. They MAY let an outstanding candidate work from home a couple of days per week.

no sponsorship.

local candidates only, but might consider someone who is originally from Long Island

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