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Principal Application Engineer, Advanced Packaging Materials

Principal Application Engineer, Advanced Packaging Materials

Crescent City Recruitment GroupIrvine, CA, United States
5 hours ago
Job type
  • Full-time
Job description

Principal Application Engineer, Advanced Packaging Materials

Irvine, California, United States

$125,000 to $150,000 + Bonus + Full Benefits + Paid Relocation

Overview

This role is for a Principal Application Engineer to join a global organization focused on innovation and cutting-edge material technologies within the Semiconductor Packaging or Adhesive Technologies space, specifically supporting the electronics market. The position involves providing high-level technical engineering support, developing in-depth application expertise, and directly engaging with key customers.

Key Responsibilities

  • Technical Leadership : Serve as the technical lead on developmental and commercialized products by optimizing material application processes.
  • Customer Interaction : Directly interact with customers to troubleshoot and solve product and process-related problems.
  • Value Creation : Ensure that new and existing products can be successfully employed by customers in a manner that brings clear and identifiable value.
  • Problem Solving : Solve technology-specific fundamental problems associated with entire product lines and / or product classes using novel approaches to application process development, troubleshooting, and material characterization.
  • Travel : Traveling of up to 10% will be part of this role.

What Makes You a Good Fit (Required Qualifications)

  • Education : Minimum of a Bachelor's degree in Material Science / Engineering, Mechanical Engineering, Chemical Engineering, or other related fields.
  • Experience : 10+ years of experience working in a chemical environment for semiconductor advanced packaging.
  • Technical Expertise :
  • Good understanding of the latest Semiconductor Packaging trends , especially 2.5D and 3D package .

  • Expertise in wafer level encapsulation and molding process in semiconductor package.
  • Communication : Strong verbal communication skills (one-on-one and group presentations) with solid interpersonal skills.
  • Work Style : Strong ownership and responsibility with a customer-oriented mindset , effective in using project and time management skills to drive projects to completion, and the ability to work as a team member and independently.
  • Health Insurance : Affordable plans for medical, dental, vision, and wellbeing starting on day 1.
  • Work-Life Balance : Paid time off (sick, vacation, holiday, volunteer time), flexible & hybrid work policies (depending on role), and vacation buy / sell program.
  • Financial : 401k matching , employee share plan with voluntary investment / matching shares, annual performance bonus, service awards, and student loan reimbursement.
  • Family Support : 12-week gender neutral parental leave (up to 20 weeks for parents giving birth), fertility support, adoption & surrogacy reimbursement, discounted child and elderly care, and scholarships.
  • Career Growth : Diverse national and international growth opportunities, access to thousands of skills development courses, and tuition reimbursement.
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