Description
A leading company in the semiconductor industry-where innovation meets precision-is seeking a Service Engineer specializing in backgrinding equipment for semiconductor manufacturing. This role is responsible for providing technical support, installation, and maintenance of advanced wafer-thinning equipment at customer sites. The position offers the opportunity to work with cutting-edge technology in a collaborative environment while supporting a key customer in Marcy, New York.
Requirements :
- Associate degree or technical certification in mechanical, electronics, or engineering fields; bachelor's degree preferred
- Strong mechanical and electrical troubleshooting skills
- Experience with semiconductor equipment or similarly complex machinery (backgrinding experience preferred)
- Ability to read and interpret mechanical drawings, electrical schematics, and piping diagrams
- Excellent problem-solving skills and ability to work independently in a field service setting
- Strong communication and customer service skills
- Willingness to travel for training (possibly several weeks during onboarding) and occasional travel for additional customers
- Physical ability to lift up to 35 lbs, bend, stoop, crawl, or climb as needed
- Ability to work safely around chemicals, electric currents, and moving mechanical parts while using proper PPE
- Must be legally authorized to work in the United States without employer sponsorship
Benefits :
Opportunity to work with state-of-the-art semiconductor manufacturing equipmentOngoing technical and professional trainingCollaborative work environment with strong engineering and customer support teamsCompetitive compensation and comprehensive benefits packageTravel : Yes - travel for training and occasional customer support required
Company Description :
A global leader in semiconductor manufacturing technology, dedicated to advancing innovation and precision through cutting-edge equipment and service solutions.