This Series B AI semiconductor startup is developing groundbreaking hardware, software, and systems to solve the critical bottlenecks in next-gen computing workloads at any scale across hyperscale cloud, edge, enterprise, 5G / 6G, and automotive infrastructure.
They recently received $125 million in funding and are ready to grow their world class team.
They are seeking a Principal Package Design Engineer to join their team, taking full ownership of large-scale, challenging designs from concept through production, and contributing across the entire lifecycle of complex package and system development.
This is a full-time hybrid role in the San Francisco Bay Area.
Job Responsibilities
- Collaborate on package planning and integration with die, package, and PCB design teams.
- Develop package specifications and perform analysis for high-speed serdes interfaces.
- Conduct bring-up, testing, and characterization of high-speed serdes and memory interfaces.
- Analyze HBM and other advanced packaging technologies.
- Specify and analyze power and high-speed signaling requirements for high-speed networking systems across die, package, PCB, connectors, and cabling.
- Work alongside systems engineers to define and implement thermal management solutions for high-power networking devices.
- Provide support to operations team during package qualification and failure analysis processes.
Job Requirements
- Minimum qualification of MS or PhD in Electrical Engineering (EE) or Mechanical Engineering (MechE), with over 10 years of relevant experience.
- Proficient in hands-on design of large body size, high power, high speed substrates using Cadence APD / SIP.
- Strong expertise in Signal Integrity (SI) and Power Integrity (PI), with mastery of Ansys HFSS and SiWave.
- Familiarity with package and PCB materials and their properties.
- Experience with 2.5D packaging and interposer integration is advantageous.
- Demonstrated success in leading substrate layout engineering teams.
- Direct involvement in production qualification and post-production activities.
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