DMTS Process Integration Engineer - Advanced Packaging | Micron, Boise

DMTS Process Integration Engineer – Advanced Packaging | Micron, Boise

Micron Boise is hiring a Process Integration Engineer to lead integration strategies for advanced memory packaging. Shape 3DIC, hybrid bonding, and FO-WLP innovations in next-gen nanotechnology.

Job Details

• Title

DMTS Process Integration Engineer – Advanced Package Technology Development (APTD)

Micron Technology, Inc.

Boise, Idaho, USA

Nanotechnology, Electronics, Materials Engineering, Electrical Engineering, Mechanical Engineering

Industry-funded (Micron)

Rolling

July 2025

United States

Required Qualification

MS or PhD in Engineering, Physics, Chemistry, or related fields

Required Experience

Experience in DRAM / NAND / 3DIC, hybrid bonding, integration, and yield optimization

Salary Details

Competitive with US-based benefits

Key Responsibilities

Required Qualifications

Micron offers a collaborative, innovation-first culture with robust benefits including healthcare plans, paid time off, global learning opportunities, and long-term career development.

Micron is an equal opportunity employer and does not charge candidates any fees. AI-assisted resumes are welcome but must reflect accurate experience. Misrepresentation may lead to disqualification. All applications are subject to Micron's equal opportunity and labor compliance policies.

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