Principal Application Engineer _ Semiconductor Advanced Package

Industry : Manufacturing & Production

Job Category : Engineering - Industrial / Manufacturing

What you ll do

Technical service engineer who provides technical engineering support for the company's Advanced Packaging Material products and responsible for developing in depth application knowledge for the company's Electronics markets.

Primary responsibilities are technical leading on developmental and commercialized products by optimization of material application processes, and direct interaction with customers to troubleshoot and solve product and process related problems.

She / he ensures that new and existing products can be successfully employed by the customers in a manner that brings clear and identifiable value.

Solves technology-specific fundamental problems associated with entire product lines and / or product classes by novel approaches to application process development, troubleshooting, and material characterization.

What makes you a good fit

Minimum of a bachelor's degree in Material Science / Engineering, Mechanical Engineering, Chemical Engineering, or other related fields, with 10+ years of experience working in a chemical for semiconductor advanced packaging environment.

Good understanding for the latest Semiconductor Packaging trend. Especially 2.5D and 3D package

Expertise in wafer level encapsulation and molding process in semiconductor package

Have strong verbal communication skills one-on-one with colleagues / customers as well as in front of groups with solid interpersonal skills, with ability to work as a team member and independently on multi-task assignments

Strong ownership and responsibility with customer-oriented mindset and good understanding of customer request & culture

Effective in using project and time management skills to drive projects to completion and focus on commitment to deliver the highest level of quality work consistently

Traveling of up to 10% will be part of this role.