Failure Analysis Engineer

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Job Description :

Broadcom is seeking an experienced and driven Failure Analysis this role you will be the technical lead who ensures the successful diagnosis and characterization of complex failures in advanced silicon (e.g. FinFET GAA) and advanced packaging technologies (e.g. CoWoS-S / L 3DIC CPO) critical to Broadcoms most sophisticated products including our industry-leading AI accelerators and high-speed networking solutions. You will leverage your deep expertise across all facets of FA (i.e. fault isolation EFA PFA) to pioneer new workflows tailored for the rapidly evolving landscape of next-generation silicon and packaging technologies. This role is built for a hands-on strategic problem-solver seeking an opportunity to grow as a technical leader collaborate with global cross-functional teams and ensure the highest quality in bleeding edge technologies.

Responsibilities :

Hands on technical expert capable of in depth fault analysis across a wide range of silicon and package technology.

Plan and execute individual FA plans through background data collection ATE datalog interpretation non-destructive analysis (optical CSAM X-Ray TDR IV curve trace)

Fault localization (ATE application board PEM DLS OBIRCh thermal scan memory)

Physical Analysis (mechanical chemical PFIB) nanoprobing and analytical techniques (FIB SEM EDX) to isolate and characterize defects.

Collaborate with global cross-functional teams (design process test reliability) to identify root causes of failures from various stages of the product lifecycle (e.g. design reliability RMA).

Clear communication of complex FA findings both written and verbal to enable data-driven corrective action of critical quality issues.

Develop and implement new failure analysis methodologies and procedures unique to advanced silicon & packaging technologies to enhance efficiency and effectiveness.

Evaluate & stay updated on the latest advancements in failure analysis techniques and semiconductor technology.

Team-based culture through open communication continuous improvement and willingness to assist others.

Qualifications :

Bachelors and 8 years of relevant experience or Masters degree in Electrical Engineering Mechanical Engineering Chemical Engineering Materials Science or a related field and 6 years of relevant experience.

Strong understanding of semiconductor device physics fabrication processes and packaging technologies.

Proficiency in various failure analysis techniques and equipment (e.g. scan diagnostics PEM DLS nanoprobing SEM EDS FIB).

Excellent problem-solving skills and a methodical approach to root cause analysis.

Ability to work independently and as part of a team in a fast-paced environment.

Broad interests self-driven lifelong learner and a good team member.

Expert project management skills capable of managing multiple root cause projects in conjunction with lab support.

Highly Desired Qualifications :

Experience with

Experience with 3DICs CoWoS-L co-packaged optics (CPO) or co-packaged copper (CPC)

Expertise in design-based FA (scan and memory diagnostics)

Expertise in beam-based FA techniques (e.g. nanoprobing PFIB delayering / cross-section)

ATE test flow generation pattern modification and hardware

In-depth knowledge of advanced package construction and failure analysis

Additional Job Description :

Compensation and Benefits

The annual base salary range for this position is $108000- $172800

This position is also eligible for a discretionary annual bonus in accordance with relevant plan documents and equity in accordance with equity plan documents and equity award agreements.

Broadcom offers a competitive and comprehensive benefits package : Medical dental and vision plans 401(K) participation including company matching Employee Stock Purchase Program (ESPP) Employee Assistance Program (EAP) company paid holidays paid sick leave and vacation time. The company follows all applicable laws for Paid Family Leave and other leaves of absence.

Broadcom is proud to be an equal opportunity employer. We will consider qualified applicants without regard to race color creed religion sex sexual orientation national origin citizenship disability status medical condition pregnancy protected veteran status or any other characteristic protected by federal state or local law. We will also consider qualified applicants with arrest and conviction records consistent with local law.

If you are located outside USA please be sure to fill out a home address as this will be used for future correspondence.

Key Skills

AED,Design Management,Business Analysis,Business Administration,Apache

Employment Type : Full-Time

Experience : years

Vacancy : 1

Monthly Salary Salary : 108000 - 172800