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Silicon Photonics Packaging Engineer Co-op
Silicon Photonics Packaging Engineer Co-opNOKIA • New York, NY, US
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Silicon Photonics Packaging Engineer Co-op

Silicon Photonics Packaging Engineer Co-op

NOKIA • New York, NY, US
15 days ago
Job type
  • Full-time
Job description

Position Title

Silicon Photonics Packaging Engineer Co-op

Number of Position(s)

1,

Duration

4 Months,

Date

January - May 2026,

Location

Onsite - Sunnyvale, CA or New York, NY

Education Recommendations

Currently a candidate for a Master's or PhD degree in Electrical Engineering, Physics, Applied Physics, or other similar field with an accredited school in US.

Responsibilities :

  • Develop semiconductor and optical packaging processes in-house, or in close partnership with contract manufacturers.
  • Design optical transceiver packages in collaboration with cross-functional teams and stakeholders to ensure package requirements are met.
  • Own Design Rules documents and ensure Design for Manufacturing specifications are met.
  • Perform mechanical integrity and thermal simulations, tolerance analyses and characterization.
  • Drive package debug activities during product validation and qualification.
  • Plan and Drive prototype assembly builds to enable deliveries for early design validation.
  • Apply in-depth knowledge of advanced packaging principles and stay current with new technological advancements.

Requirements :

  • Experience with package and process design / development from design to production.
  • Knowledge of design for manufacturing, 2.5D / 3D packaging, and TSVs.
  • Experience with documentation of fabrication, inspection, and assembly processes.
  • Solid interpersonal, communication and problem-solving skills in order to interact with engineering staff, external vendors and contractors effectively.
  • Nice to Have :

  • Understanding of optical epoxies, non-hermetic packaging, and high-volume packaging and thermal analysis of 2.5 / 3D packages.
  • Experience in the semiconductor chip and wafer-level back-end processing, assembly, and / or packaging.
  • Experience in high-speed electronics package design and / or laser package design.
  • Experience with thermo-mechanical simulations using ANSYS or similar software.
  • Experience with metrology techniques such as SEM / XSEM, confocal microscopy, or acoustic imaging.
  • Familiarity with design and simulations of optical packaging using free space optics or fiber coupling.
  • Nokia is committed to innovation and technology leadership across mobile, fixed and cloud networks. Your career here will have a positive impact on people's lives and will help us build the capabilities needed for a more productive, sustainable, and inclusive world.

    Nokia offers continuous learning opportunities, well-being programs to support you mentally and physically, opportunities to join and get supported by employee resource groups, mentoring programs and highly diverse teams with an inclusive culture where people thrive and are empowered.

    Nokia is committed to inclusion and is an equal opportunity employer. Nokia has received the following recognitions for its commitment to inclusion & equality :

  • One of the World's Most Ethical Companies by Ethisphere
  • Gender-Equality Index by Bloomberg
  • Workplace Pride Global Benchmark
  • Nokia's employment decisions are made regardless of race, color, national or ethnic origin, religion, gender, sexual orientation, gender identity or expression, age, marital status, disability, protected veteran status or other characteristics protected by law.

    US / Canada Nokia Offers a comprehensive benefits package that includes but is not limited to :

  • Corporate Retirement Savings Plan
  • Health and dental benefits
  • Short-term disability, and long-term disability
  • Life insurance, and AD&D - Company paid 2x base pay
  • Optional or Supplemental life and AD&D insurance (Employee / Spouse / Child)
  • Paid time off for holidays and Vacation
  • Employee Stock Purchase Plan
  • Tuition Assistance Plan
  • Adoption assistance
  • Employee Assistance Program / Work Life Resource Program
  • J-18808-Ljbffr

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    Packaging Engineer • New York, NY, US

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