Associate Microelectronics / Microelectronics Wet Etch and Plating Engineer - 2nd Shift

RELOCATION ASSISTANCE : Relocation assistance may be available

CLEARANCE TYPE : Secret

TRAVEL : Yes, 10% of the Time

Description

At Northrop Grumman, our employees have incredible opportunities to work on revolutionary systems that impact people's lives around the world today, and for generations to come. Our pioneering and inventive spirit has enabled us to be at the forefront of many technological advancements in our nation's history - from the first flight across the Atlantic Ocean, to stealth bombers, to landing on the moon. We look for people who have bold new ideas, courage and a pioneering spirit to join forces to invent the future, and have fun along the way. Our culture thrives on intellectual curiosity, cognitive diversity and bringing your whole self to work - and we have an insatiable drive to do what others think is impossible. Our employees are not only part of history, they're making history.

The Northrop Grumman Microelectronics Center (NGMC) of Northrop Grumman Mission Systems is seeking a Second shift Microelectronics Wet Etch and Plating Engineer in the Compound area for our Advanced Technology Lab (ATL). Located outside of Baltimore, Maryland we design, manufacture, and test semiconductor products for internal and commercial production customers as well as emerging technology programs. Northrop Grumman's ATL semiconductor foundry is a unique capability supporting a range of production microelectronic devices (Silicon, Gallium Arsenide, Gallium Nitride, Silicon Carbide, Carbon Nanotubes) and providing leading edge technology development in superconducting electronics. Our devices enable a number of Northrop Grumman's ground-based radars, avionic radars, and space systems. Join us for the chance to work with an amazing, experienced, and talented team while helping serve your country.

The qualified candidate will have knowledge of wet etch and plating processing for semiconductor and device fabrication. Candidate will join a production team working closely with multiple programs and area managers to support on-time delivery of products derived from a variety of silicon semiconductor technologies. As a second shift Associate Wet Etch and Plating Engineer, you will interface with both peers and representatives from operations, equipment engineering, process integration, and program management. You will support research, design, and development of new microelectronic, optoelectronic, micro-electromechanical and sensor manufacturing processes with silicon materials. The candidate will utilize wet processing equipment to support development of new techniques for fabrication of semiconductor technologies and will support Process Integrators and Senior Process Engineers on development of wets processes for new devices.

Core responsibilities for this position include monitoring and maintaining wet etch and plating processing tools, process specifications, continuous improvement initiatives, tool installation, technician training, and RCCA investigations under the supervision of senior engineers. Candidate would preferably have experience in semiconductor processing in wet etch and plating.

#NGATL

This position will work on second shift : M-F (2 pm - 11 pm) and will train on First Shift (7 : 30am-5pm).

This requisition may be filled as either Associate Microelectronics Wet Etch and Plating Engineer or Microelectronics Wet Etch and Plating Engineer.

Basic Qualifications for Associate Microelectronics Wet Etch and Plating Engineer :

Must have Bachelor's degree in Chemical, Electrical, or Materials Engineering or any related STEM degree with 1year related semiconductor fabrication experience.

Have an understanding / knowledge of semiconductor processing.

Must have general MS Office suite experience

Must be able to work a large percentage of time working with chemicals in a Class 100 cleanroom environment.

Must be able to meet all physical and PPE requirements.

Must be able to work Second shift : M-F (2 pm - 11 pm)

Must be a US citizen

Must be able to obtain a Secret clearance

Basic Qualifications for Microelectronics Wet Etch and Plating Engineer :

Must have Bachelor's degree in Chemical, Electrical, or Materials Engineering or any related STEM degree with 2 years related semiconductor fabrication experience (0 years with a MS).

Have an understanding / knowledge of semiconductor processing.

Must have general MS Office suite experience

Must be able to work a large percentage of time working with chemicals in a Class 100 cleanroom environment.

Must be able to meet all physical and PPE requirements.

Must be able to work Second shift : M-F (2 pm - 11 pm)

Must be a US citizen

Must be able to obtain a Secret clearance

Preferred Qualifications :

• Hands-on experience with both wet etch and electroplating tools, processes, and troubleshooting.
• Knowledge of Statistical Process Control (SPC) and understanding of SPC tools and use.
• Experience in structured problem-solving methodology to troubleshoot equipment and process issues.
• Secret Clearance

#NGMCFab

Primary Level Salary Range : $70,600.00 - $106,000.00

Secondary Level Salary Range : $85,400.00 - $128,000.00

The above salary range represents a general guideline; however, Northrop Grumman considers a number of factors when determining base salary offers such as the scope and responsibilities of the position and the candidate's experience, education, skills and current market conditions.

Depending on the position, employees may be eligible for overtime, shift differential, and a discretionary bonus in addition to base pay. Annual bonuses are designed to reward individual contributions as well as allow employees to share in company results. Employees in Vice President or Director positions may be eligible for Long Term Incentives. In addition, Northrop Grumman provides a variety of benefits including health insurance coverage, life and disability insurance, savings plan, Company paid holidays and paid time off (PTO) for vacation and / or personal business.

The application period for the job is estimated to be 20 days from the job posting date. However, this timeline may be shortened or extended depending on business needs and the availability of qualified candidates.

Northrop Grumman is an Equal Opportunity Employer, making decisions without regard to race, color, religion, creed, sex, sexual orientation, gender identity, marital status, national origin, age, veteran status, disability, or any other protected class. For our complete EEO and pay transparency statement, please visit http : / / www.northropgrumman.com / EEO. U.S. Citizenship is required for all positions with a government clearance and certain other restricted positions.