Job Description
We are seeking a highly experienced ASIC Technical Program Manager with deep expertise in Analog Mixed-Signal (AMS) ASIC developments. This role will lead complex semiconductor development programs from specification through to production, while managing global teams, executive stakeholders, and customer relationships using data-driven methodologies.
Key Responsibilities
- Lead full lifecycle execution of AMS-intensive ASIC programs, including PMIC integration, from specification definition to part delivery .
- Drive technical collaboration across analog / mixed-signal design, system architecture, RTL, verification, physical design, packaging, and test engineering.
- Oversee integration of key AMS components such as ADCs, DACs, PLLs, voltage regulators, and sensor interfaces.
- Manage global cross-functional teams across time zones, ensuring alignment, accountability, and timely execution.
- Engage directly with executive management teams to communicate program status, risks, and strategic decisions.
- Serve as the primary interface for customer program management , ensuring expectations are met and feedback is incorporated.
- Apply data-driven project management practices to track KPIs, forecast risks, and optimize resource allocation.
- Coordinate with external IP vendors, foundries, OSATs, and EDA tool providers to manage dependencies and mitigate risks.
- Track program milestones, resource allocation, and risk mitigation plans using industry-standard tools.
Qualifications
Bachelor's or master's degree in electrical engineering, Computer Engineering, or related field.15+ years of experience in ASIC / SoC development and technical program management.Proven experience managing complex AMS programs and delivering PMIC-integrated ASICs to production.Demonstrated success in executive stakeholder engagement , customer-facing program leadership , and global team management .Strong proficiency in data-driven project tracking , including dashboards, metrics, and predictive analytics.Familiarity with silicon packaging technologies (e.g., QFN, BGA, MCM, 2.5D / 3D stacking), mixed-signal design flows, and high-speed interfaces.Strong project management skills with proficiency in tools like MS Project, Jira, Confluence, and data visualization platforms.Excellent communication, leadership, and organizational skills.