Principal / Senior Principal Microelectronics Electroplating Engineer

Requisition ID : R10176360

Category : Engineering

Location : Linthicum, Maryland, United States of America

Clearance Type : Secret

Telecommute : No- Teleworking not available for this position

Shift : 1st Shift (United States of America)

Travel Required : Yes, 10% of the Time

Relocation Assistance : Relocation assistance may be available

Positions Available : 1

At Northrop Grumman, our employees have incredible opportunities to work on revolutionary systems that impact people's lives around the world today, and for generations to come. Our pioneering and inventive spirit has enabled us to be at the forefront of many technological advancements in our nation's history. We look for people who have bold new ideas, courage and a pioneering spirit to join forces to invent the future, and have fun along the way. Our culture thrives on intellectual curiosity, cognitive diversity and bringing your whole self to work.

The Northrop Grumman Microelectronics Center (NGMC) of Northrop Grumman Mission Systems is seeking an exceptionally talented and motivated Microelectronics Electroplating Process Engineer to join our Advance Material Wets Team.

The Microelectronics Electroplating Process Engineer will work in various R&D and production process areas at ATL. The selected candidate should be hands-on and demonstrate an ability to communicate well with others.

The Microelectronics Electroplating Process Engineer will be responsible for :

• Leading and developing new wet etch processes for new materials on emerging technologies in both microelectronic and superconducting electronics.
• Mentoring junior engineers to support their career development.
• Responsible for the procurement and start-up of new semiconductor equipment and processes.
• Developing and maintaining process documentation.
• Working with Environmental, Health, and Safety to improve safety of processes, recommend PPE, environmental monitoring, and hazardous waste handling.
• Training technicians and junior engineers on tool operations.
• Interfacing with customers, program managers, other unit process engineers, and integration engineers during the design and execution of process development and improvement projects.
• Performing all other related duties as assigned.

Basic Qualifications for Principal Microelectronics Electroplating Process Engineer :

Basic Qualifications for Senior Principal Microelectronics Electroplating Process Engineer :

Preferred Qualifications :

Salary Range : $102,400 - $153,600

Salary Range 2 : $127,000 - $190,600

The above salary range represents a general guideline; however, Northrop Grumman considers a number of factors when determining base salary offers such as the scope and responsibilities of the position and the candidate's experience, education, skills and current market conditions.

Northrop Grumman is committed to hiring and retaining a diverse workforce. We are proud to be an Equal Opportunity / Affirmative Action Employer, making decisions without regard to race, color, religion, creed, sex, sexual orientation, gender identity, marital status, national origin, age, veteran status, disability, or any other protected class. U.S. Citizenship is required for all positions with a government clearance and certain other restricted positions.

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