Lead Photonic Product / Packaging Design Engineer

About the job

POSITION OVERVIEW

Client is seeking an experienced Lead Photonic Product / Packaging Design Engineer to play a critical role in building the next-generation of far-UVC light engines for disinfection and sensing applications. This full-time position will focus on the design and production release of photonic packages, requiring a candidate whose proven abilities show they can work across multiple disciplines. The candidate should be a hands-on “doer”, eager to take ownership of product design challenges and execute detailed instructions with minimal oversight. Innovation, communication, and collaborative problem-solving abilities are required.

KEY RESPONSIBILITIES

Lead the product design and release for innovative packaged far-UVC light engines that achieve industry-leading performance

Develop optoelectronic packaging solutions for hybrid and integrated photonic assemblies that address thermal, electrical, optical, and material science challenges

Interface between R&D teams and manufacturing partners to guide photonic product design and ensure Design for Manufacturing / Assembly (DfMA) and Design for Quality

Analyze product performance data sets and steer product requirements for prototype / pilot / production scaling

Coordinate assembly specifications and change management controls for ramp to volume manufacturing

Own supply-chain resolutions, operational troubleshooting, and failure analysis (FA) throughout photonic product launch

Document inspection instructions, test criteria, and non-conformance actions in support of the manufacturing quality system

Work with cross-functional teams, consultants, and partners to ensure packages are cost-effective and meet performance requirements

Foster a collaborative and innovative culture across the organization, promoting knowledge sharing and continuous learning.

QUALIFICATIONS & REQUIREMENTS

Master’s Degree in Electrical Engineering, Mechanical Engineering, Physics, Optics, Materials Science, or an equivalent field

6+ years of photonic (optoelectronic) industry experience in new product development (NPD) and prototype / pilot / product launch

Expertise in hands-on assembly and packaging for semiconductor diode laser packaging (e.g. 14-pin butterfly, TO-Cans, CoS, etc)

Expertise in coordinating and managing photonic assembly vendors

Experience in statistical data analysis / visualization (such as with JMP, R, etc.)

Proficient in mechanical design processes and 3D CAD software (such as SolidWorks or AutoDesk Inventor)

Proficient in thermal and mechanical constraints of laser packaging, such as heat transfer, mechanical stress, and thermo-electric cooling

Knowledge of Statistical Process Control (SPC), Design for Manufacturing and Assembly (DfMA), Failure Analysis (FA), Root Cause Analysis, and Lean Manufacturing methods

Knowledge of design constraints for on-chip photonic devices (e.g. waveguides, couplers, lasers, etc.) and electronic packaging (e.g. wirebonds, interconnects, vias, etc.)

Strong analytic and communication skills, flexibility, and ability to work well in a dynamic, multi-disciplinary environment

PREFERRED SKILLS

Ph.D. Degree in Electrical Engineering, Mechanical Engineering, Physics, Optics, Materials Science, or an equivalent field

Experience interacting directly with external photonic customers

Experience working with blue laser diodes or other III-Nitride based lasers

Experience working with UV-emitting devices

Experience with transitioning product lines to external foundries and / or contract manufacturers

Experience working in a semiconductor / wafer manufacturing environment