Senior Packaging Electrical Simulation Engineer

onsemi is seeking a self-driven and motivated professional to join their Corporate Central Engineering modeling and simulation team, located in (Portland, Maine, Phoenix, AZ or Sunnyvale, CA). As a Senior Packaging Electrical Simulation Engineer, you will have the opportunities to support new package and system integration development and new product design, assembly and process, quality and reliability, and customers in worldwide.

The successful candidate will have the opportunity to:

• Do packaging and system level integration electrical simulation
• Do electrical-thermal-mechanical interaction for ISG chiplet, ASG, 3D integration and next generation break-through power module
• Parasitic RLC for low frequency
• High frequency simulation including MIPI/S-parameters
• Do analysis and correlation of modeling results to measured data
• Develop and maintain the state of art system integration, electrical, electrical-thermo modeling methodology to improve the modeling work efficiency and accuracy
• Setup and maintain the HW/SW environment for electrical-thermo-mechanical modeling
• Provide support to packaging electrical modeling needs for field, application and customers.
• Innovation of new technology through simulation
• Develop the state of art simulation methodology such as AI and machine learning algorithm, probability and optimization algorithm
• PhD degree (or Master degree with 3 year experiences) in Electrical Engineering, electrical simulation, Physics with e-simulation.
• Experience and skills in electrical modeling and simulation in packaging and system level
• Knowledge and experience of CAD concepts and Solidworks
• Familiar with semiconductor packaging and system integration
• Familiar with material electrical properties
• Strong knowledge of problem analysis and diagnosis technique
• Familiar with package test and analysis, quality assurance, and reliability methods
• Ability to perform model correlation to empirical measurement
• Familiar with the Unix/Linux operating system
• Familiar with FEA software ANSYS HFSS, SIWave, Q3D, Maxwell and ANSYS electronics desktop
• Strong English communication capability
• Strong learning capability
• Good team player