Hardware Reliability Engineer

About the Team :

Born at X, Google's Moonshot Factory, Taara is on a mission to connect billions of people lacking abundant and affordable internet today by pioneering the way we use light to deliver faster, cheaper, more reliable connectivity. Lead the charge in bringing our groundbreaking wireless optical communication and photonics chip technologies to the world. Drive our growth story as we scale innovative solutions across the world. Join us to light the way for bridging the digital divide and illuminating the future.

About the role :

Our team is seeking a hands-on Hardware Reliability Engineer to drive the reliability and robustness of our next generation Wireless Optical Communication (WOC) system and hardware components. You'll lead reliability testing, failure analysis, and design optimization for our electrical, optical and photonic systems. You'll be responsible for identifying test and qualification procedures for in-house designed components and systems to ensure manufacturing yield and long-term field performance. The scope will span the complete technology stack from semiconductor wafers, dies, photonic integrated circuits (PICs) and packaged assemblies to full communication systems. Working within a multidisciplinary engineering leadership team you'll collaborate closely with photonics, optics, manufacturing, product management, manufacturing and operations teams.

The ideal candidate will have experience in modeling, guiding, testing, and validating production-ready semiconductor, photonic and III-V devices. The position seeks highly-motivated individuals that enjoy working in a small dynamic results-oriented team environment, with a passion for solving challenging problems that can lead to high-impact advances in technology. This is a hands-on, technical leadership position where you will explore, pathfind and define key reliability elements for our next generation Wireless Optical Communication (WOC) architecture options and sustainability of the current generation.

How you will make 10x impact :

• Provide inputs on architecture to meet reliability and testing protocols from die, package, module and assembled communication system based on first principles understanding and modeling.
• Lead failure analysis, reliability modeling and collaborate across engineering team to drive corrective action
• Determine criteria and implement die level and package level stress testing
• Model and define requirements for electrical, mechanical, optical and system environmental reliability testing. Manage and track reliability risks and lead implementation of the testing and validation.
• Develop and analyze die, optical, mechanical and photonic components to predict long-term performance under field conditions.

What you should have :

It'd be great if you also had these :

The US base salary range for this full-time position is $185,000 - $225,000 + bonus + equity + benefits. Our salary ranges are determined by role, level, and location. Within the range, individual pay is determined by work location and additional factors, including job-related skills, experience, and relevant education or training. Your recruiter can share more about the specific salary range for your location during the hiring process.