Principal Engineer - Packaging

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Job Description :

We are seeking a highly motivated and experienced Principal Packaging Engineer to join our NPI Packaging team. You will be a member of the FPGA (Field Programmable Gate Array) Business Unit, which is a leader in research, development, and manufacturing of highly reliable non-volatile Field Programmable Gate Arrays. In this role, the candidate will be responsible for advanced semiconductor package development. The ideal candidate will have a background in semiconductor packaging and assembly, and a strong ability to collaborate cross-functionally, solve technical problems, and manage projects.

Responsibilities

• Co-design packages with Silicon, Packaging, and Systems engineering teams to ensure designed packages meet electrical, mechanical and thermal requirements of high-performance flip chip packages.
• Work with business unit's IC design teams to select the optimum package solution on cost, performance, manufacturability, and reliability for new FPGA devices, satisfying business unit's roadmap for new products.
• Learn and define assembly BOM, process, troubleshoot, and support packaging issues of new advanced technology.
• Create package design documentation and assembly instructions.
• Participate in package technology development and / or other business productivity projects which have broad team impact (e.g. assembly process enhancement, new technology / structure development etc.)
• Manage package qualification for commercial and automotive applications.
• Coordinate with assembly vendors on new packages from development to high volume production.

Requirements / Qualifications :

Preferred Qualifications

Travel Time : 0% - 25%

Physical Attributes :

Feeling, Hearing, Other, Seeing, Talking, Works Alone, Works Around Others

Physical Requirements :

15% standing, 15% walking, 70% sitting, 100% In doors; Usual business hours

Pay Range :

We offer a total compensation package that ranks among the best in the industry. It consists of competitive base pay, restricted stock units, and quarterly bonus payments. In addition to these components, our package includes health benefits that begin day one, retirement savings plans, and an industry leading ESPP program with a 2 year look back feature. Find more information about all our benefits at the link below :

Benefits of working at Microchip

The annual base salary range for this position, which could be performed in California, is $70,000 - $163,000.

Microchip Technology Inc is an equal opportunity / affirmative action employer. All qualified applicants will receive consideration for employment without regard to sex, gender identity, sexual orientation, race, color, religion, national origin, disability, protected Veteran status, age, or any other characteristic protected by law.

For more information on applicable equal employment regulations, please refer to the Know Your Rights : Workplace Discrimination is Illegal Poster.

To all recruitment agencies : Microchip Technology Inc. does not accept unsolicited agency resumes. Please do not forward resumes to our recruiting team or other Microchip employees. Microchip is not responsible for any fees related to unsolicited resumes.