Staff NPI Package Design Engineer

For over four decades, Cirrus Logic has been propelled by the top engineers in mixed-signal processing. Our rockstar team thrives on solving complex challenges with innovative end-user solutions for the world's top consumer brands. Cirrus Logic is also known for its award?winning culture, built on a foundation of inclusion and fairness, meaningful community engagement, and delivering enjoyable employee experiences at every turn. But we couldnt do it without our extraordinary workforce and thats where you come in. Join our team and help us continue to make Cirrus Logic an exceptional place to grow your career!

Are you ready to make a significant impact in a fast?paced, innovative environment?

We are seeking a Staff Package Design Engineer to join our dynamic team in Edinburgh, UK. In this role, youll work closely with internal and external customers to develop cutting?edge packaging solutions for high?performance products including amplifiers, codecs, and DSPs. Our packaging technologies span from traditional wire?bond QFN to advanced WLCSP and flip?chip designs.

Responsibilities

• Collaborate with cross?functional teams to drive package designs that meet Cirrus performance, reliability, and manufacturability requirements
• Define package requirements from electrical, thermal, and mechanical point of view in close cooperation with Design and layout teams
• Utilize AutoCAD, GDS tools, Siemens Fast3D and Cadence SiP Layout tool to complete physical design, electrical simulation and manufacturing validation solution for package design, including die bump array / BGA integration refinement using die information
• Drive continuous improvement processes to assure accuracy between the interface of the package to the die and PCB
• Work with cross functional teams (Customer, Designers, OSATs) to establish and maintain design rules for WLCSP, wire bond, and other packages
• Understand DFM checking and modification to improve assembly yield and prevent manufacturing issues
• Grow and promote automation processes throughout the package design flow
• Develop test vehicles that properly assess bump placement, PCB proximity effects, WLCSP RDL stack up and the like on final chip performance
• Close collaboration with customers to resolve various design issues between the piece part and PCB

Required Skills and Qualifications

Preferred Skills and Qualifications

This position is based in Edinburgh, UK

This is a hybrid remote position and will follow a 2+ day in-office work schedule, with in-office days based on business needs and team preference. You must be based within commutable distance of the work location listed on the job posting, or willing to relocate prior to beginning employment with Cirrus Logic.

At Cirrus Logic, we believe that diversity drives innovation, and we are committed to encouraging an open and collaborative culture where different approaches, ideas, and points of view are respected and valued. We aim to promote a workplace where everyone can contribute irrespective of race, colour, national origin, religion or belief, gender or gender identity, sexual orientation, age, marital status, pregnancy status, or disability.

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