Sr. Mgr / Dep. Director Advanced Packaging

Advanced Packaging Strategy Leader

GlobalFoundries is a leading full-service semiconductor foundry providing a unique combination of design, development, and fabrication services to some of the world's most inspired technology companies. With a global manufacturing footprint spanning three continents, GlobalFoundries makes possible the technologies and systems that transform industries and give customers the power to shape their markets.

Summary Of Role

We seek a dynamic business leader to define and drive the strategy for advanced packaging development in our ULP CMOS product lines. In this role, you will set the strategic direction, develop comprehensive solutions, articulate value propositions, and ensure successful customer product designs, ultimately delivering innovative solutions and propelling business growth.

Essential Responsibilities

Strategic Roadmap Development : Set and lead GF's advanced packaging roadmap across our technology nodes, aligning with overall business objectives.

Solution Definition & Customer Success : Define complete advanced packaging solutions including the necessary interface IP and reference designs, positioning GF to enable successful customer product designs.

Value Proposition Communication : Clearly articulate the value proposition of our advanced packaging solutions, positioning GF as a leader in the industry.

Customer and Partner Engagement : Identify target customers and maintain and strengthen external relationships with customers and technology partners.

Business Case Development : Plan, develop, and analyze business cases, including R&D and capital investments, asset utilization, and cost elements, to inform pricing and go-to-market strategies.

Program Management : Define and implement effective systems to manage and monitor the success of product development programs and customer engagements.

Perform all activities in a safe and responsible manner and support all Environmental, Health, Safety & Security requirements and programs.

Required Qualifications

BSEE or another relevant technical degree with 12+ years of relevant experience

Subject matter expertise in advanced packaging technology and applications

10 years in advanced packaging semiconductor product lines, marketing, or technology development

Semiconductor design, test, EDA, IP, and end applications

Understand how to market to large global customers and emerging companies

Travel up to 25%

Preferred Qualifications

An MSEE or an MBA with marketing concentration

A Ph.D. in electrical engineering or related field

3+ years in a semiconductor marketing team as either a provider or customer of products using embedded memory

Experience working in a globally dispersed environment with team members in multiple locations and an ability to thrive in a matrixed organizational structure.

Technical knowledge and ability to engage senior-level technical experts internally and externally. Effective communication skills in written, verbal, and presentation formats

Expected Salary Range

$131,900.00 - $263,000.00 The exact salary will be determined based on qualifications, experience and location.