Principal Microelectronics Engineer

Job Description

Job Description

Job ID : TAP00113

Position : Principal Microelectronics Engineer

Location : US - Maryland, DC, Virginia (Partial Telework)

Category : Hardware

Clearance Requirement : None (U.S. Citizenship required)

Education Requirement : BS in Electrical Engineering (or related technical field)

Experience Requirement : 10+ Years

TAP is seeking to hire a Principal Microelectronics Engineer to join our team! If you are a highly motivated engineer who enjoys a challenging and dynamic environment where your contributions are both critical and valued, this company will provide you with the tools and opportunity to thrive.

The Principal Microelectronics Engineer will be working alongside the Department of Commerce National Institute of Standards and Technology (DOC NIST) in planning and executing microelectronics programs related to the CHIPS and Science Act. The successful candidate will work closely with a small team of interdisciplinary, inter-agency technical subject matter experts (SMEs) and program managers in collaboration with industry and academia to strengthen the domestic microelectronics supply chain. The Principal Microelectronics Engineer will work to shape, write, release, assess, and award industry Notice of Funding Opportunities (NOFOs). And, once awarded, they will support the execution and management of the resulting programs (managing scope, cost, schedule, risk, resources, etc.). This position requires an individual with both technical and program management skills.

Required Qualifications (Must Have’s) :

• U.S. Citizenship
• Ability and willingness to obtain a Public Trust clearance.
• Bachelors Degree in Electrical Engineering, Computer Engineering, Mechanical Engineering, Manufacturing Engineering, Materials Science, Physics, Computer Science or related technical discipline.
• 10+ years of experience

A relevant Masters Degree may be substituted for 2 years of experience (MS w / 8+ years)

This position requires the ability to brief senior-level executives within the government, industry and academia.

Materials & Substrates : Experience with fabrication projects utilizing organics, glass, and semiconductor-based materials such as those found in advanced PCB, fan-out wafer level packaging, and or SIP device fabrication.  Embedded components, laminated films such as ABF, spun-on films such as BCB, as well as copper metallization techniques.

Desired Qualification (Nice to Have’s) :

By submitting your resume for this position, you understand and agree that TAP Engineering may share your resume, as well as any other related personal information or documentation you provide, with its subsidiaries and affiliated companies for the purpose of considering you for other available positions.

TAP Engineering is an Equal Opportunity Employer and applicants receive lawful consideration for employment without regard to race, color, religion, sex, sexual orientation, gender identity, national origin, disability, or protected veteran status.

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