Engineering Technician - MMIC

Description

Mini-Circuits designs, manufactures and distributes integrated circuits, modules, and sub-systems for high-performance radio frequency (RF) and microwave applications. With design, sales and manufacturing locations in over 30 countries, Mini-Circuits' products are used in a range of wired and wireless communications applications. Our products are also used in detection, measurement and imaging applications, including military communication, guidance and electronic countermeasure systems, commercial, scientific, military land, sea and aircraft; automotive systems, medical systems, and industrial test equipment.

Mini-Circuits' sells its products to over 20,000 customers globally through our direct sales force, applications engineering staff, sales representatives, as well as through our extensive website.

Position Summary :

The Engineering Technician works closely with MMIC design, program management, quality, mechanical design and RF test teams to transition the product from development phase to production phase. The Engineering Technician builds, repairs and tests boards using extremely small and fragile bare die and SMT components, must have meticulous hand-eye coordination and manual dexterity to install, assemble, inspect and test electronic components during product assembly, per documented work instructions.

The Technician must set up, operate, calibrate, maintain, troubleshoot and repair assembly equipment and tooling such as manual and auto epoxy dispensing systems, wire bonder machine, reflow ovens, soldering and rework stations, wire pull, die shear, measuring and inspection microscope, laser marking and laser trimming, as well as to operate RF and DC test equipment whenever needed.

Salary Range : $85,000 - $105,000 per year

Job Function :

• Wire bonding process development / production.
• Die attach process development / production.
• Epoxies dispense.
• Package molding.
• Failure Analysis using variety tools (die shear, bond pull, Keyence etc).
• PCB / Component level assembly, troubleshooting, and rework.
• Component selection for high frequency / power devices.
• Set up assembly equipment and tooling (epoxy dispenser, wire bond, oven profile) and kitting of bill of materials as required per assembly diagram and instructions.
• Performs manual die attach of bare die MMICs, chip capacitors and other micro-electronic components using electrically conductive epoxies. Dispenses epoxy using both manual and a benchtop dispensing system.
• Performs wire bonding tasks using a variety of wire and ribbon sizes and both ball and wedge-based techniques.
• Perform wire treading of 1 mil diameter wire on ball bonder and wedge bonder.
• Define and execute basic DOEs to adjust wire bond parameters to achieve good wire bonding.
• Reads and works from assembly drawings and provide markups with improvements / design changes when necessary.
• Conducts quality inspection of components and assembled parts at specified intervals and report deviations from standard.
• Perform equipment set-up, calibration and preventative maintenance.
• Maintain work area and equipment in a clean and orderly condition and follows prescribed safety procedures. and assists other staff with keeping lab clean.
• Set up and operate equipment for electrical testing of RF components.

The duties, responsibilities and expectations described above are not a comprehensive list and additional tasks may be assigned to the member, within the scope of the position.

Qualifications :

Physical Demands :

The physical demands described here are representative of those that must be met by an employee to successfully perform the essential functions of this job. While performing the duties of this job, the employee is regularly required to talk and hear. The employee frequently is required to stand, walk, sit and use hands to operate a computer keyboard. The employee is occasionally required to reach with hands and arms. The employee must occasionally lift and / or move up to 10 pounds. Specific vision abilities required by this job include close vision, and ability to adjust focus. Reasonable accommodations may be made to enable individuals with disabilities to perform the essential functions.

Must have extremely good vision and steady hand coordination abilities required for a manual handling of small dies and microelectronic components using tweezers semi-automatic wire bonder. This position requires spending a significant amount of time working under a microscope.

Additional Requirements / Skills :

Disclaimer : The listed qualifications and requirements for each position are intended as guidelines. Mini-Circuits reserves the right to hire outside of these guidelines at Management's discretion.

Mini-Circuits is an Equal Opportunity Employer and does not discriminate on the basis of actual or perceived age, race, creed, color, national origin, sexual orientation, military status, sex, disability, predisposing genetic characteristics, marital status, familial status, gender identity, gender dysphoria, pregnancy-related condition, and domestic violence victim status or protected class characteristic, or any other protected characteristic as established by federal or state law