Process Engineer, Texas Institute for Electronics

Process Engineer, Texas Institute For Electronics

Hiring Department : Texas Institute For Electronics

Position Open To : All Applicants

Weekly Scheduled Hours : 40

FLSA Status : To Be Determined At Offer

Earliest Start Date : Ongoing

Position Duration : Expected To Continue

Location : PICKLE RESEARCH CAMPUS

General Notes

This position may be filled at a higher-level title, relative to experience and qualifications of the selected candidate. Relocation assistance may be available.

About Us

The Texas Institute for Electronics (TIE) is a rapidly growing public-private partnership of preeminent semiconductor systems and defense electronics companies, national labs, and academic institutions. Our mission is to advance the state-of-the-art in critical semiconductor domains such as advanced packaging, and in the process to help restore U.S. leadership in semiconductor manufacturing. We are developing cutting-edge semiconductor manufacturing equipment and processes that will define future roadmaps of semiconductor logic, memory, heterogenous integration, chip cooling, etc. We are seeking a number of motivated individuals to join our team and help us achieve our mission.

TIE is one of the fastest growing research centers at the University of Texas at Austin and part of the Cockrell School of Engineering, a global leader in technology innovation and engineering education for over a century. With 11 undergraduate and 13 graduate programs, over 20 research centers and a faculty community that boasts one of the highest number of National Academy of Engineering members among U.S. universities, Texas Engineering has launched some of the nation's most accomplished leaders and pioneered world-changing solutions in virtually every industry, from space exploration to energy to health care. Situated in the heart of Austin named "America's Coolest City" by Expedia and "The Best Place to Live in the U.S." by U.S. News and World Report the Cockrell School embodies the city's innovative spirit.

UT Austin, recognized by Forbes as one of America's Best Large Employers, provides outstanding employee benefits and total rewards packages that include :

• Competitive health benefits (employee premiums covered at 100%, family premiums at 50%)
• Voluntary Vision, Dental, Life, and Disability insurance options
• Generous paid vacation, sick time, and holidays
• Teachers Retirement System of Texas, a defined benefit retirement plan, with 8.25% employer matching funds
• Additional Voluntary Retirement Programs : Tax Sheltered Annuity 403(b) and a Deferred Compensation program 457(b)
• Flexible spending account options for medical and childcare expenses
• Robust free training access through LinkedIn Learning plus professional conference opportunities
• Tuition assistance
• Expansive employee discount program including athletic tickets
• Free access to UT Austin's libraries and museums with staff ID card
• Free rides on all UT Shuttle and Austin CapMetro buses with staff ID card
• For more details, please see : Benefits | Human Resources and UT Austin Employee Experience | Human Resources

Purpose

The Process Engineer develops and executes semiconductor fabrication process flows for advanced 3D HI applications using a wide variety of internal and external fabrication resources.

Responsibilities

Required Qualifications

Process Engineer I :

High School Diploma or GED and at least six years of experience in materials science, physics, chemistry, chemical engineering, electrical engineering, mechanical engineering, or other relevant disciplines, or, Bachelor's degree in materials science, physics, chemistry, chemical engineering, electrical engineering, mechanical engineering, or other relevant disciplines.

Process Engineer II :

Bachelor's degree in materials science, physics, chemistry, chemical engineering, electrical engineering, mechanical engineering, or other relevant disciplines and eight years of relevant experience in nanofabrication and exposure to wafer processing and characterization in cleanrooms, including experience working with standard semiconductor equipment for lithography, coating, plasma processes including deposition and etch, wet cleans, electroplating, annealing, chemical mechanical polishing, bonding, packaging, metrology and inspection, or, Master's degree in materials science, physics, chemistry, chemical engineering, electrical engineering, mechanical engineering, or other relevant disciplines and one year of relevant experience in nanofabrication and exposure to wafer processing and characterization in cleanrooms, including experience working with standard semiconductor equipment for lithography, coating, plasma processes including deposition and etch, wet cleans, electroplating, annealing, chemical mechanical polishing, bonding, packaging, metrology and inspection.

Senior Process Engineer :

Bachelor's degree in materials science, physics, chemistry, chemical engineering, electrical engineering, mechanical engineering, or other relevant disciplines and ten years of experience in nanofabrication and exposure to wafer processing and characterization in cleanrooms, including experience working with standard semiconductor equipment for lithography, coating, plasma processes including deposition and etch, wet cleans, electroplating, annealing, chemical mechanical polishing, bonding, packaging, metrology and inspection.

For all levels :

Relevant education and experience may be substituted as appropriate.

Preferred Qualifications

Process Engineer I :

Three years of experience in nanofabrication and exposure to wafer processing and characterization in cleanrooms, including experience working with standard semiconductor equipment for lithography, coating, plasma processes including deposition and etch, wet cleans, electroplating, annealing, chemical mechanical polishing, bonding, packaging, metrology and inspection.

Process Engineer II :

Master's degree or higher. Five or more years of relevant experience in nanofabrication and exposure to wafer processing and characterization in cleanrooms, including experience working with standard semiconductor equipment for lithography, coating, plasma processes including deposition and etch, wet cleans, electroplating, annealing, chemical mechanical polishing, bonding, packaging, metrology and inspection.

Senior Process Engineer :

Master's degree or higher. Ten or more years of experience in nanofabrication and exposure to wafer processing and characterization in cleanrooms, including experience working with standard semiconductor equipment for lithography, coating, plasma processes including deposition and etch, wet cleans, electroplating, annealing, chemical mechanical polishing, bonding, packaging, metrology and inspection.

For all levels :

Salary Range

Working Conditions

Required Materials

Important for applicants who are NOT current university employees or