Package Design Engineer
Goldenpick TechnologiesSan Jose, CA, United StatesHace 6 días
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Descripción del trabajo
Requirements / Skills :
- Possess Mentor Graphics, Cadence, PLA knowledge
- Multiple layers package design (8+) experience
- Understanding of substrate manufacturing design rule and assembly rule
- Possess Flip Chip Package Design Concept
- Good communication skill.
- May require vendor on-site support
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Design Engineer • San Jose, CA, United States
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