Staff Packaging Engineer
Title : Staff PackagingEngineer
Location : San JoseCA (Onsite)
Duration : FullTime Benefits
End Client : Semiconductor Company
JobDescription
- Responsible for defining substrate / package design rulesprocess flow and material set for new automotive power modulepackages
- Drive alignment between modulesubstrate (PCB) design requirements and supplier capabilities toenable new product development and volume manufacturing of powermodules
- Develop new assembly technologies runprocess DOEs to define process windows for new packagedevelopment
- Drive reliability testing andqualification of new automotive module packages in conjunction withthe reliability group
- Work closely withoffshore assembly and substrate partners to develop newprocesses
- Work closely with IC design teams todefine package design rules and define packages to meet theirrequirements
- Collaborate with multifunctionalteams within Power Integrations for successful developmentqualification and production ramp of new module products
JobRequirements
- BSDegree in Electrical Engineering Mechanical Engineering MaterialScience.
- Minimum experience 12 years insemiconductor packaging technology.
- Experienceleaded multidie packages.
- Understanding oforganic laminate technologies manufacturing and suppliercapabilities.
- Experience in SMT or passiveintegrated package assembly is a plus.
- Experience with packaging processes : Wafer BackgrindingWafer Dicing Die Attach Wirebonding Molding and PackageSingulation. (Flip Chip is a plus)
- Experiencewith package substrate design rules tools (includingAutoCAD).
- Knowledge of AEQ Automotivereliability requirements.
- Knowledge of APQPautomotive development process
- Knowledge ofJEDEC / IPC design standards.
- Ability to setupDesign Rule Checks for verification of every aspect of the PCBlayout a plus.
- Travel to Asia to attendtechnology reviews and resolve subcon / supplier issues
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