Failure Analysis Engineering Manager

Job Description

Job Description

FII USA, Inc., a Foxconn Technology Group Company, is seeking a Failure Analysis Engineering Manager to lead failure analysis investigations on PCB / PCBA issues and manage electrical engineering operations and reporting activities. Once a part of the team, you will be responsible for a wide variety of tasks within the Operations Department and in an R&D Lab and production-support environment and have the opportunity to display strong technical and leadership skills to expand your career in Smart Manufacturing.

The Failure Analysis Engineering Manager will oversee comprehensive testing and reporting activities, manage a team of engineers and technicians, and drive the development of new methods and analytical capabilities while assisting the Operations Department as needed.

Job Responsibilities :

Manage and oversee failure analysis investigations on PCBs and PCBAs, including solder joint, component, and environmental testing failures.

Operate, supervise, and expand the use of failure analysis and engineering testing equipment, ensuring timely and accurate reporting.

Summarize, analyze, and record test results, preparing formal reports for customers and internal global teams.

Develop and maintain laboratory documentation (procedures, best practices, monthly reports, ROI justifications).

Lead road mapping projects to discover, develop, and deploy new methods and testing capabilities.

Support materials consultation activities, including requirements review, specification creation, supplier quality support, and quality administration.

Perform and oversee teardown of mechanical and electronic assemblies for lab analysis while preserving areas of interest.

Provide leadership, training, and oversight to FA engineers and technicians across multiple shifts.

Maintain compliance with IPC, JEDEC, ISO / IEC 17025, and other applicable standards.

Foster a Safety First culture and ensure compliance with internal and external policies.

Perform other duties as assigned.

Qualifications

Bachelor’s or Master’s degree in Electrical Engineering, Computer Engineering, or related technical field required.

5–10 years of experience in electronics failure analysis, debugging, or product design for computing and storage platforms.

Demonstrated ability to debug complex hardware issues using logic analyzers, oscilloscopes, multimeters, and related test equipment.

Strong understanding of server and storage technologies, including Intel and AMD x86 / ARM multicore processors, DDR2–DDR5 and NAND memory, and PCA design.

Working knowledge of high-speed interfaces and protocols such as PCIe, SAS, SATA, NVMe, SCSI, Ethernet, Fibre Channel, Wi-Fi, and Bluetooth.

Familiarity with full hardware / software development life cycle, including firmware and diagnostic test methodologies.

Proven experience collaborating with cross-functional and cross-organizational engineering teams.

Excellent analytical and problem-solving skills with strong attention to detail.

Strong written and verbal communication skills with the ability to present findings to both technical and non-technical audiences.

Self-motivated and able to perform effectively in a fast-paced, customer-oriented environment with minimal supervision.

Willingness to travel domestically and internationally to support global FA operations and team development.

Must be able to sit or stand for extended periods; must be able to lift up to 50 lbs.

Reasons you should work for us :

Comprehensive benefits package including medical, dental, and vision insurance coverage.

Basic life insurance and short-term disability coverage provided by employer.

Supplemental life insurance and long-term disability coverage options available.

401K with employer contribution.

Personal, Vacation, and Holiday paid time off for all full-time employees.

Onsite Aurora Health & Wellness Center available for all employees.

Employees are continuously encouraged to learn and grow their careers in smart manufacturing.

About FII USA, Inc., a Foxconn Technology Group Company :

FII USA, Inc, a Foxconn Technology Group Company, is a global leader in smart manufacturing and industrial internet services. With a strong presence in the digital economy, we offer a comprehensive range of solutions in cloud computing, industrial internet, smart home, 5G, and network communication equipment. Fueled by continuous innovation and a commitment to sustainable development, we have become a key player in the electronic manufacturing service industry and sit at the forefront of driving advanced industry development.

FII USA, Inc is an Equal Opportunity employer. All qualified applicants will receive consideration for employment, without regard to sex, race, color, religion, national origin, age, marital status, political affiliation, sexual orientation, gender identity, genetic information, disability or protected veteran status. We are committed to providing a workplace free of any discrimination or harassment.

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