Principal Reliability / FA Engineer

Principal Reliability / FA Engineer

If you are looking for a challenging and exciting career in the world of technology, then look no further. Skyworks is an innovator of high-performance analog semiconductors whose solutions are powering the wireless networking revolution. Through our broad technology expertise and one of the most extensive product portfolios in the industry, we are Connecting Everyone and Everything, All the Time.

At Skyworks, you will find a fast-paced environment with a strong focus on global collaboration, minimal layers of management, and the freedom to make meaningful contributions in a setting that encourages creative thinking. We are excited about the opportunity to work with you and glad you want to be part of a team of talented individuals who together are changing the way the world communicates.

We are looking for a highly skilled and experienced GaAs / Silicon Multi-Chip Module package / Assembly reliability Engineer to join New Technology Introduction (NTI) team. The successful candidate will be responsible for ensuring the reliability of MCM from design to packaging technology. This includes developing and implementing reliability tests, analyzing failure data, and collaborating with cross-functional teams to identify and mitigate potential reliability risks. The candidate will also have good understanding mechanical stress, thermal modeling analysis and surface mount process for BLR (Board Level Reliability) testing.

Develops, implements, and maintains Package reliability testing, and BLR, for package / assembly technologies; and ensures failure analysis and root cause pursuit. Coordinates both in-house and offshore reliability activities.

Defines and implements standard procedures for testing and evaluating reliability of products and of new package / assembly technologies and technology changes.

Participates in the review of new packages, and assembly technologies to contribute to the reliability requirements. Helps assembly and package engineering to gather and analyze reliability data.

Generates qualification plans for assessing package / assembly reliability and publishes qualification reports in a timely manner.

Responsible for supporting business units in terms of new package / product introduction, and customer complaints through reliability assessment and analysis.

Works on issues with different scope where analysis of data or the situation requires the evaluation of a variety of factors, including the current business trend.

Provides technical assistance, when required, to managers and engineers.

Prepares weekly activity report with executive summary and dashboard of qualification activities.

BS degree in Electrical Engineering with at least 12 years of experience in packaging, assembly of semiconductor IC-s and supervision of activities related to the Reliability and Failure Analysis semiconductor IC industry (MS degree with 8 years or PhD with 5 years also acceptable). Experience in dealing with JEDEC standards for reliability assessments of semiconductor products. Experience in Board Level Reliability based on JEDEC, IPC. Experience in MCM assembly / package reliability engineering, industry standards such as JEDEC, AEC, and IPC. Experience in semiconductor reliability assessments and failure analysis. Knowledge of reliability test equipment. Knowledge of reliability & FA techniques. Knowledge of semiconductor FA equipment.

Degree in Semiconductors or Microelectronics.