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Micron
3D Stacked Memory ArchitectMicron • San Jose, California, US
3D Stacked Memory Architect

3D Stacked Memory Architect

Micron • San Jose, California, US
30+ days ago
Job type
  • Full-time
Job description

Our vision is to transform how the world uses information to enrich life for all.

Micron Technology is a world leader in innovating memory and storage solutions that accelerate the transformation of information into intelligence, inspiring the world to learn, communicate and advance faster than ever.

We build the memory technologies that power the world’s most demanding platforms. Our team works at the intersection of silicon, packaging, and systems, pushing the limits of bandwidth, efficiency, and reliability. If you want to shape where memory goes next, this is the place to do it.

This role sits at the center of our next-generation stacked memory strategy. As a Senior Memory Architect, you will define architectures that span die, stack, package, and system, and influence how customers and platforms adopt them. You will lead through technical depth, guide major architectural decisions, and help translate bold ideas into production reality.

Responsibilities:

  • Define next-generation 3D stacked memory architectures spanning bandwidth, capacity, power efficiency, and RAS
  • Lead die-to-system co-optimization across memory die, PHY, TSVs, bonding, packaging, and system integration
  • Architect stack-aware RAS, telemetry, and reliability mechanisms for high-density memory systems
  • Drive long-range technology strategy for stacked memory and advanced packaging
  • Engage deeply with customers, platform partners, and standards bodies to influence system and ecosystem direction

Minimum Qualifications:

  • Bachelor’s degree or equivalent practical experience in Electrical Engineering, Computer Engineering, Computer Science, or a related field
  • Extensive industry experience in stacked memory, 3D integration, advanced packaging, or high-performance semiconductor architecture
  • Deep hands-on expertise in high-speed I/O, TSV-based stacking, power delivery, thermals, and signal integrity
  • Proven ability to translate system-level requirements into memory and package architecture
  • Demonstrated technical leadership across teams and complex architectural decisions

Preferred Qualifications:

  • Master’s degree or PhD in Electrical Engineering or a related technical field
  • Recognized expertise in stacked memory or advanced packaging, internally or externally
  • Experience influencing tier-1 customers, platform architects, or industry standards
  • Track record of architectural innovations shipped in production silicon or platforms
  • Experience mentoring senior engineers or architects

The US base salary range that Micron Technology estimates it could pay for this full-time position is:

$177, - $387, a year

Additional compensation may include benefits, bonuses and equity.
Our salary ranges are determined by role, level, and location. The range displayed on each job posting reflects the minimum and maximum target base pay for new hire salaries of the position across all US locations. Within the range, individual pay is determined by work location and additional job-related factors, including knowledge, skills, experience, tenure and relevant education or training. The pay scale is subject to change depending on business needs. Your recruiter can share more about the specific salary range for your preferred location during the hiring process.

Please note that the compensation details listed in US role postings reflect the base salary only, and do not include bonus, equity, or benefits.

As a world leader in the semiconductor industry, Micron is dedicated to your personal wellbeing and professional growth. Micron benefits are designed to help you stay well, provide peace of mind and help you prepare for the future. We offer a choice of medical, dental and vision plans in all locations enabling team members to select the plans that best meet their family healthcare needs and budget. Micron also provides benefit programs that help protect your income if you are unable to work due to illness or injury, and paid family leave. Additionally, Micron benefits include a robust paid time-off program and paid holidays. For additional information regarding the Benefit programs available, please see the Benefits Guide posted on .

Micron is proud to be an equal opportunity workplace and is an affirmative action employer. All qualified applicants will receive consideration for employment without regard to race, color, religion, sex, sexual orientation, age, national origin, citizenship status, disability, protected veteran status, gender identity or any other factor protected by applicable federal, state, or local laws.

To learn about your

To learn more about Micron, please visit

Micron Prohibits the use of child labor and complies with all applicable laws, rules, regulations, and other international and industry labor standards.

Micron does not charge candidates any recruitment fees or unlawfully collect any other payment from candidates as consideration for their employment with Micron.

AI alert: Candidates are encouraged to use AI tools to enhance their resume and/or application materials. However, all information provided must be accurate and reflect the candidate's true skills and experiences. Misuse of AI to fabricate or misrepresent qualifications will result in immediate disqualification.

Fraud alert: Micron advises job seekers to be cautious of unsolicited job offers and to verify the authenticity of any communication claiming to be from Micron by checking the official Micron careers website in the

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3D Stacked Memory Architect • San Jose, California, US

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