Etch/SRP SBU Product Line Manager (TPM)

Salary $163,000.00 - $224,000.00 Location Santa Clara, CA What You'll Do The Etch Service Business Unit develops innovative service products and solutions that help semiconductor manufacturers improve productivity, tool performance, uptime, and cost of ownership across a global installed base. Our team works at the intersection of engineering, systems integration, operations, data, and field execution to solve complex technical challenges and deliver measurable customer value. This is a highly collaborative environment where technical depth, cross‑functional leadership, and customer focus are essential to success. We are seeking a strong Technical Program Manager / Systems Engineering leader to drive service product development for Applied Materials’ Etch Service Business Unit (SBU). This role is responsible for leading complex, cross‑functional programs that improve tool productivity, uptime, matching, and on‑wafer performance across the semiconductor installed base. The ideal candidate brings deep systems engineering expertise, a strong track record in technical program execution, and the ability to integrate hardware, software, analytics, and service readiness into scalable customer solutions. This leader will work across business units, engineering, operations, and field teams to deliver high‑value service products that meet customer requirements and business objectives. Responsibilities Lead end‑to‑end technical program management for service product development initiatives supporting Etch chambers and subsystem solutions. Own cross‑functional program execution across engineering, product, operations, supply chain, analytics, and field service teams to deliver integrated, high‑value service offerings. Apply systems engineering expertise to define requirements, manage technical tradeoffs, and integrate electrical, mechanical, software, physics, algorithms, and data capabilities into scalable service products. Drive program planning, milestone management, risk mitigation, and executive communication throughout the product development and release lifecycle. Partner with equipment business units and cross‑functional teams to ensure service readiness, including spares, training, Design for Install (DfI), Design for Service (DfS), Design for Automated Service (DfAS), and data infrastructure. Develop service product roadmaps aligned to customer technology inflections, voice‑of‑customer inputs, and business priorities. Define and align critical system parameters, data requirements, and product performance metrics with business unit and engineering stakeholders. Ensure field scalability and deployment readiness by driving training, documentation, operational support models, and manufacturing and repair pathways for newly developed service products. Own cost, performance, and reliability targets, including Cost of Ownership (CoO), MTTR, MTBC, productivity, and serviceability metrics. Collaborate with data science and engineering teams to develop and validate predictive and AI‑enabled service solutions that improve customer outcomes and product value. Support new product introduction (NPI) and concurrent development activities by ensuring alignment on requirements, service design, and data strategy during the development cycle. Desired Skills, Competencies, Experience & Education Bachelor’s or Master’s degree in Engineering, Physics, Materials Science, or a related technical field. 15+ years of relevant experience in semiconductor equipment, systems engineering, technical program management, product development, or process development. Demonstrated success leading complex cross‑functional technical programs from concept through release and deployment. Strong systems engineering background with experience integrating hardware, software, data, and service workflows into end‑to‑end solutions. Deep semiconductor domain expertise, with experience in plasma etch, deposition, materials engineering, or semiconductor equipment systems preferred. Experience with new product introduction (NPI), service readiness, and field deployment in a high‑technology environment. Strong customer orientation with the ability to translate voice‑of‑customer and market needs into technical requirements and program priorities. Proven ability to drive decisions, influence stakeholders, and communicate effectively with engineering, operations, product, finance, marketing, and executive leadership. Experience managing product cost, reliability, serviceability, and KPI‑based business outcomes. Strong analytical, organizational, and project management skills, with the ability to lead multiple priorities in a fast‑paced environment. Additional Information Time Type: Full time Employee Type: Assignee / Regular Travel: Yes, 10% of the Time Relocation Eligible: Yes Equal Opportunity Statement Applied Materials is an Equal Opportunity Employer. Qualified applicants will receive consideration for employment without regard to race, color, national origin, citizenship, ancestry, religion, creed, sex, sexual orientation, gender identity, age, disability, veteran or military status, or any other basis prohibited by law. #J-18808-Ljbffr