Product Engineering Manager (Project 9 / IB4)

We are seeking an experienced Product Engineering Manager to lead the development, introduction, and continuous improvement of high-performance computing (HPC) servers, including rack-mount systems and GPU / accelerator nodes, within a fast-paced manufacturing environment.

This role will oversee the engineering team responsible for product readiness, manufacturability, cost optimization, and sustaining engineering throughout the product lifecycle.

This role leads the engineering team responsible for enabling reliable, scalable, and cost-effective production of enterprise-class hardware.

The ideal candidate brings deep expertise in server architecture, high-speed PCB design, power and thermal systems, and large-scale manufacturing.

The ideal candidate has a strong technical foundation in electronics manufacturing—PCB design, DFM / DFT, PCBA processes, component engineering, reliability—and excels at cross-functional leadership.

Key Responsibilities Product Development & NPI Drive the full NPI cycle for HPC servers—from prototype to high-volume ramp across global manufacturing partners.

Oversee EVT, DVT, and PVT activities, ensuring validation coverage for compute, storage, networking, power, and thermal domains.

Partner with R&D, design engineering, and manufacturing to ensure product readiness, robust documentation, and efficient design transfer.

Drive Design for Manufacturability (DFM), Design for Test (DFT), and Design for Assembly (DFA) reviews for all new products.

Server Hardware Manufacturing & Process Integration Collaborate with SMT, system integration, mechanical, and test engineering to ensure stable, repeatable server builds.

Oversee assembly process definition, fixture / tooling design, functional test strategies, and traceability requirements.

Ensure alignment of manufacturing architecture with server performance and reliability goals (power delivery, airflow, component stress profiles, etc.).

Sustaining Engineering & Continuous Improvement Lead root-cause analysis and corrective actions (RCCA) for quality issues, field returns, and product escalations.

Manage engineering changes (ECOs), component qualifications, and product revisions.

Drive continuous improvement initiatives focused on yield, reliability, cost, and throughput.

Provide technical leadership on issues involving :

• PCIe Gen4 / Gen5 interconnects High-speed memory technologies (DDR4 / DDR5) GPU / accelerator integration Advanced power delivery networks Thermal design, validation, and cooling strategies (air, liquid, cold plate) Lead failure analysis for component, board, and system-level issues across prototypes, ramp, and field returns.
• Cross-Functional Leadership Serve as the technical interface between Engineering, Operations, Supply Chain, and Quality.
• Manage supplier and manufacturing partner technical activities (PCBA, plastics, metals, test houses, etc.).
• Provide guidance and mentoring to product engineers and junior engineering staff.
• Project & Stakeholder Management Develop and track project schedules, deliverables, and risk mitigation plans.
• Communicate status, challenges, and technical recommendations to leadership and cross-functional teams.
• Required Qualifications 7+ years of experience in server, data center hardware, enterprise hardware, or HPC systems manufacturing.
• Strong understanding of PCBA design / assembly, signal integrity, thermal systems, and complex system integration.
• Experience with high-speed interfaces (PCIe, DDR, Ethernet 100G / 200G / 400G, NVMe).
• Proven track record leading NPI for compute or enterprise-grade hardware.
• Strong analytical, problem-solving, and cross-functional leadership skills.
• Demonstrated experience leading NPI programs or large-scale product releases.
• Proficiency with engineering documentation and PLM systems (e.g., Agile, Arena, Windchill).
• Excellent communication and cross-functional leadership abilities.
• Preferred Qualifications Experience with high-density PCB designs, BGA, fine-pitch components, and high-speed digital or RF products.
• Experience with GPU / accelerator platforms (NVIDIA, AMD, Intel).
• Understanding of BIOS / UEFI, BMC / IPMI / Redfish, and system management controllers.
• Knowledge of thermal modeling / testing, airflow simulation, and cooling technologies.
• Familiarity with data center compliance and reliability standards (UL, FCC, CE, NEBS, etc.).
• Familiarity with environmental, regulatory, and compliance requirements (UL, CE, RoHS, WEEE, FCC, etc.).
• Experience working with Tier-1 ODMs for server manufacturing.
• Background in working with contract manufacturers (CMs) domestically or internationally.
• Experience with automated test equipment (ATE) and functional test strategy development.
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