Talent.com
Principal Application Engineer, Advanced Packaging Materials
Principal Application Engineer, Advanced Packaging MaterialsButler Recruitment Group LLC • Irvine, California, United States
Principal Application Engineer, Advanced Packaging Materials

Principal Application Engineer, Advanced Packaging Materials

Butler Recruitment Group LLC • Irvine, California, United States
5 hours ago
Job type
  • Full-time
  • Quick Apply
Job description

Principal Application Engineer, Advanced Packaging Materials

Irvine, California, United States

$125,000 to $150,000 + Bonus + Full Benefits + Paid Relocation

Overview

This role is for a  Principal Application Engineer  to join a global organization focused on innovation and cutting-edge material technologies within the Semiconductor Packaging or Adhesive Technologies space, specifically supporting the electronics market. The position involves providing high-level technical engineering support, developing in-depth application expertise, and directly engaging with key customers.

Key Responsibilities

Technical Leadership :  Serve as the technical lead on developmental and commercialized products by optimizing material application processes.

Customer Interaction :  Directly interact with customers to troubleshoot and solve product and process-related problems.

Value Creation :  Ensure that new and existing products can be successfully employed by customers in a manner that brings clear and identifiable value.

Problem Solving :  Solve technology-specific fundamental problems associated with entire product lines and / or product classes using novel approaches to application process development, troubleshooting, and material characterization.

Travel :  Traveling of up to  10%  will be part of this role.

What Makes You a Good Fit (Required Qualifications)

Education :  Minimum of a  Bachelor's degree  in Material Science / Engineering, Mechanical Engineering, Chemical Engineering, or other related fields.

Experience :   10+ years of experience  working in a chemical environment for semiconductor advanced packaging.

Technical Expertise :

Good understanding of the latest  Semiconductor Packaging trends , especially  2.5D and 3D package .

Expertise in  wafer level encapsulation and molding process  in semiconductor package.

Communication :  Strong verbal communication skills (one-on-one and group presentations) with solid interpersonal skills.

Work Style :  Strong ownership and responsibility with a  customer-oriented mindset , effective in using project and time management skills to drive projects to completion, and the ability to work as a team member and independently.

Health Insurance :  Affordable plans for medical, dental, vision, and wellbeing starting on day 1.

Work-Life Balance :  Paid time off (sick, vacation, holiday, volunteer time), flexible & hybrid work policies (depending on role), and vacation buy / sell program.

Financial :   401k matching , employee share plan with voluntary investment / matching shares, annual performance bonus, service awards, and student loan reimbursement.

Family Support :   12-week gender neutral parental leave  (up to 20 weeks for parents giving birth), fertility support, adoption & surrogacy reimbursement, discounted child and elderly care, and scholarships.

Career Growth :  Diverse national and international growth opportunities, access to thousands of skills development courses, and tuition reimbursement.

Create a job alert for this search

Application Engineer • Irvine, California, United States