Job Title : Senior Product Lead - Advanced Packaging and Semiconductor Electronics
Location : Fremont, CA (Hybrid - 3 days a week in office)
Job Type : 12+ Months Contract
Job Description :
We are seeking a Senior Product Lead with expertise in Advanced Semiconductor Electronics and ASIC Design to drive innovation in semiconductor packaging and AI. The ideal candidate will have extensive experience in mixed-signal design, chiplet integration, and advanced packaging technologies.
Key Responsibilities :
- Lead the product development lifecycle for cutting-edge semiconductor electronics and ASICs.
- Collaborate with cross-functional teams to innovate and integrate mixed-signal and chiplet designs.
- Drive advancements in chiplet integration and high-speed chiplet I / O.
- Ensure signal integrity and power integrity throughout the design and implementation phases.
- Stay up to date with the latest trends in advanced packaging and semiconductor processing.
- Mentor and guide junior engineers, fostering innovation and continuous learning.
Required Qualifications :
Bachelor's or Master's degree in Electrical Engineering, Computer Engineering, or related field.10+ years of experience in semiconductor electronics and ASIC design.Proficiency in mixed-signal design and chiplet design.In-depth knowledge of advanced packaging, BEOL & FEOL semiconductor processing.Experience with current packaging and substrate technologies for advanced packaging.Strong expertise in chiplet integration and high-speed chiplet I / O.Proven track record in signal integrity and power integrity in complex designs.Excellent leadership, communication, and project management skills.Preferred Qualifications :
Ph.D. in Electrical Engineering or related field.Experience with leading industry-standard design and simulation tools.Published works or patents in semiconductor technologies.ET_PB01