Principal Application Engineer - Sintering & Electronics Materials

Principal Application Engineer

Irvine, California

Full Time

Traveling of up to 10% is required for this role.

We are seeking a Principal Application Engineer with a strong background in semiconductor materials , specifically sintering pastes , to join our Electronics team. You'll be responsible for technical leadership, application development, and customer interaction to support and optimize material usage in power electronics and packaging.

Key Responsibilities :

• Lead technical engineering efforts for sintering paste products and applications in electronics.
• Optimize material performance and processing for both development-stage and commercialized products.
• Provide hands-on technical support and troubleshooting for customer processes.
• Serve as the key liaison for application engineering across internal R&D, product development, and external clients .
• Develop in-depth understanding of customer requirements and deliver high-value, technically sound solutions.
• Lead DOE (Design of Experiments) and statistical analysis to validate performance and reliability.
• Maintain customer satisfaction by managing complex, on-site support for application issues.
• Document and report experimental data, insights, and recommendations.
• Collaborate cross-functionally with product managers, quality, and sales teams .

Required Qualifications :

Preferred Qualifications :

Recruiter Submission Template - Principal Application Engineer - Sintering & Electronics Materials

Full Name :

Degree Major with University and Completion Year :

Total Experience in Materials Engineering / Semiconductor Environment :

Total Experience in Power Electronics / Packaging / Sintering Materials :

Do you have 10+ years of experience working with materials in semiconductor, power packaging, or electronics environments?

Do you have experience working with sintering adhesives, high thermal interface materials, or similar materials?

Have you supported or led customer-facing application engineering projects?

Do you have experience applying Design of Experiments (DOE) and statistical analysis methods?

Do you have hands-on experience with reliability or performance testing of adhesive technologies?

Do you have experience supporting process optimization and troubleshooting in electronics packaging?

Have you worked on cross-functional teams (R&D, Sales, Manufacturing, etc.)?

Are you experienced in semiconductor packaging trends (e.g., power modules, sintered die attach)?

Are you willing to travel up to 10% for customer support or collaboration?

Motivation / Reason for Relocation (if applicable) :

Motivation / Reason for Interest in this Position :

Contact Number :

Email ID :

LinkedIn Profile :

Full Address (Street, City, State, ZIP Code) :

Notice Period (in weeks) :

Ideal Start Date for the Candidate :

Current Work Authorization Status (U.S. Citizen, Green Card, etc.) :

Expected Salary :

Are you willing to work onsite in Irvine, CA (with occasional travel)? (Yes / No) :