A company is looking for an Electronics Packaging Analyst III.
Key Responsibilities
Conduct mechanical design, stress, and thermal analysis for electronics packaging development
Collaborate in a multi-disciplined team for design trades and detailed analysis activities
Provide test input and collaborate with engineering personnel to interpret test results
Required Qualifications
5+ years of professional experience in electronics packaging or related fields
Experience with stress, thermal, and solder fatigue analysis of flight electronic components
Knowledge of mechanical and system-level requirements
Experience in developing reliable, compliant flightworthy components
Ability to support environmental testing and correlate results with design criteria
Packaging Engineer • Fremont, California, United States