Package Design Engineer

Job Summary

As a Package Design Engineer, you will be responsible for the design, simulation, and optimization of sophisticated packaging methods for high-performance electronics. You will work with cross-functional teams to guarantee that our products meet reliability, thermal, and electrical performance standards while driving innovation in semiconductor packaging. This role provides an excellent opportunity to work on next-generation technologies in a fast-paced, collaborative setting.

Key Responsibilities

• Use tools like Cadence, Ansys, or Siemens EDA to design and create integrated circuit packaging solutions such as substrate layouts, interconnects, and thermal management systems.
• Validate package designs by simulating signal integrity, power supply, and thermomechanical stress.
• Work with the R&D, manufacturing, and testing teams to prototype and iterate package architectures.
• Analyze failure modes and make recommendations to increase yield and dependability.
• Keep up with industry trends in advanced packaging (e.g., 2.5D / 3D integration, fan-out wafer-level packaging) and incorporate them into projects.
• Document designs, generate technical reports, and assist with patent filings as needed.
• Ensure compliance with industry standards (such as JEDEC) and environmental legislation.

Skills

Education & Experience

Annual Pay

The base income ranges from $120,000 to $160,000, depending on experience, location, and credentials. This range illustrates our commitment to providing competitive compensation for outstanding individuals in the United States.

Compensation & Benefits