Senior or Principal Product Manager, Texas Institute for Electronics

Job Details

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General Notes

Texas Institute for Electronics (TIE) is a transformative, well-funded semiconductor foundry venture combining the agility of a startup with the scale of a national initiative.

A key part of our mission is to advance the state of the art in 3D heterogeneous integration (3DHI), chiplet-based architectures, and multi-component microsystems- catalyzing breakthroughs across microelectronics, artificial intelligence, quantum computing, high-performance computing, and next-generation healthcare devices.

Backed by $1.4 billion in combined funding from DARPA, Texas state initiatives, and strategic partners, we are building foundational capabilities in advanced packaging and integrated design infrastructure to restore U.S. leadership in microelectronics manufacturing.

Our 3DHI and chiplet integration platforms integrate novel thermal management and advanced interconnect solutions to deliver unprecedented performance and energy efficiency. Operating at the intersection of defense electronics and commercial markets, TIE offers a rare opportunity to reimagine an industry from the ground up and build transformative products with global impact.

UT Austin, recognized by Forbes as one of , provides outstanding and packages that include:

• Competitive health benefits (employee premiums covered at 100%, family premiums at 50%)

• Voluntary Vision, Dental, Life, and Disability insurance options

• Generous paid vacation, sick time, and holidays

• Teachers Retirement System of Texas, a defined benefit retirement plan, with 8.25% employer matching funds

• Additional Voluntary Retirement Programs: Tax Sheltered Annuity 403(b) and a Deferred Compensation program 457(b)

• Flexible spending account options for medical and childcare expenses

• Robust free training access through LinkedIn Learning plus professional conference opportunities

• Tuition assistance

• Expansive employee discount program including athletic tickets

• Free access to UT Austin's libraries and museums with staff ID card

• Free rides on all UT Shuttle and Austin CapMetro buses with staff ID card

• For more details, please see and and

Purpose

The purpose of this role is to drive the product strategy and roadmap for TIE’s advanced 2.5D/3D microsystems integration platforms, ensuring alignment between engineering execution, market needs, and business objectives. By serving as the bridge between technical teams and customer requirements, you will facilitate cross-functional collaboration and strategic partnerships to enhance product success and industry presence.

Responsibilities

• Own the product strategy and roadmap for TIE’s advanced 2.5D/3D microsystems integration platforms, aligning engineering execution with market needs and business objectives. In this role (reporting into TIE’s Business Group), you will serve as the bridge between technical teams and customer requirements to drive product success.
• Author and maintain comprehensive Product Requirements Documents (PRDs) that guide TIE’s process development, EDA integration, and packaging engineering teams. You’ll ensure all stakeholders have a clear blueprint so development efforts remain aligned, efficient, and focused on the right prioriTIEs.
• Drive cross-functional collaboration across internal teams—including packaging R&D, process engineering, design automation, and product marketing—to ensure product features and releases are cohesive and aligned with overall strategy. You will be the key interface keeping everyone on the same page and moving toward common goals.
• Engage closely with customers and industry partners (e.g. leading foundries and advanced packaging providers) to align our capabilities with evolving industry needs. You will represent TIE in technical discussions, gather customer feedback, and form strategic partnerships that enhance our microsystems platform and ecosystem presence.
• Serve as a technical champion for 2.5D/3D integration – leverage your deep understanding of advanced packaging technologies to guide internal decision-making. You’ll act as a liaison in customer design reviews and industry forums, ensuring TIE’s solutions address real-world challenges in chiplet-based system design.
• Develop and execute detailed program plans covering scope, schedules, risk mitigation, resource allocation, and customer communication to drive predictable delivery of platform milestones. You will deliver results in fast-paced, multi-stakeholder engagements by managing dependencies and proactively resolving roadblocks.
• Create technical documentation and collateral (such as integration guidelines, reference designs, and user guides) that support customer design teams and highlight the unique value of TIE’s technologies. You’ll ensure our technical content and training materials enable rapid adoption and success for our ecosystem users.
• Monitor advanced packaging market trends and competitive developments, providing actionable insights to inform product positioning, feature prioritization, and differentiation. Your awareness of emerging standards and ecosystem shifts will help keep TIE at the forefront of the industry.
• Champion a culture of accountability and transparency across all product workstreams. You make sure stakeholders are informed, expectations are managed, and commitments are met — fostering trust and a shared sense of mission among teams.
• Other related functions as assigned.

Required Qualifications

• Education: BS in Electrical Engineering, Computer Engineering, or a related technical discipline.
• Industry Experience:
• Senior Product Manager: 5+ years of experience in semiconductor packaging, microsystems integration, or related microelectronics product development, with a deep understanding of the advanced packaging ecosystem and market trends.
• Principal Product Manager: 10+ years of experience in semiconductor packaging, microsystems integration, or related microelectronics product development, with a deep understanding of the advanced packaging ecosystem and market trends.
• Technical Expertise: Proven expertise in advanced packaging technologies (e.g. 2.5D interposers, through-silicon vias, wafer-level packaging, 3D stacking, RDL/interposer technologies) and heterogeneous integration techniques. You have direct experience developing or managing cutting-edge packaging solutions and understand the nuances of modeling, simulation, and reliability across electrical, thermal, and mechanical domains.
• Process & EDA Familiarity: Working knowledge of semiconductor fabrication processes and electronic design automation (EDA) flows for PDK/ADK creation and integration with major EDA vendor flows. You can effectively interface with process engineers and EDA teams, ensuring packaging solutions integrate smoothly with design and manufacturing workflows.
• Exceptional communication skills. You know how to simplify the complex, create clear deliverables, and build trust with both technical and business stakeholders. You excel at translating between engineering and market/customer contexts.
• Startup DNA. You’re energized by ambiguity, act with urgency, and take ownership of outcomes. You thrive in a fast-paced, dynamic environment and aren’t afraid to wear many hats to get the job done.
• Execution mindset. You have demonstrated experience driving progress across multiple initiatives in a hands-on role, without the need for layers of management. You plan, execute, and deliver—reliably and proactively.
• Location. Austin, Texas is preferred for close collaboration with our engineering teams and partners. Hybrid work arrangements may be possible, with travel up to 30–50% as needed. (Any hybrid or flexible work arrangement would be subject to TIE and University policies and approvals relating to employment laws and regulations.)
• Relevant education and experience may be substituted as appropriate.

Preferred Qualifications

• Advanced Degree: MS or PhD in Electrical Engineering, Computer Engineering, Mechanical Engineering, Materials Science, or a related field.

• Program Leadership: Proven program management chops – you can demonstrate end-to-end ownership of complex programs involving multiple customer or partner stakeholders. You know how to define success metrics, manage interdependencies, and keep teams aligned and motivated even as projects grow in complexity.

• Vendor/Partner Management: Experience working directly with subcontractors, vendors, or external partners to define clear expectations, manage deliverables, and hold teams accountable to milestones.

• Industry Background: Prior experience at a leading semiconductor foundry or packaging house is a strong plus, giving you firsthand insight into advanced packaging processes and the broader industry ecosystem.

Ready to Make Your Mark?

If you’re excited to push the boundaries of microsystems innovation and lead ambitious programs with industry-shaping partners, let’s talk. Help build the future of microelectronics with TIE.

Salary Range

TIE Pays Industry Competitive Salaries

Working Conditions

• May work around standard office conditions
• Repetitive use of a keyboard at a workstation
• Use of manual dexterity (ex: using a mouse)

Work Shift

• Monday - Friday
• Occasional/frequent nights/weekends required

Required Materials

• Resume/CV
• 3 work references with their contact information; at least one reference should be from a supervisor
• Letter of interest (optional)

Important for applicants who are NOT current university employees or contingent workers: You will be prompted to submit your resume the first time you apply, then you will be provided an option to upload a new Resume for subsequent applications. Any additional Required Materials (letter of interest, references, etc.) will be uploaded in the Application Questions section; you will be able to multi-select additional files. Before submitting your online job application, ensure that ALL Required Materials have been uploaded. Once your job application has been submitted, you cannot make changes.

Important for Current university employees and contingent workers: As a current university employee or contingent worker, you MUST apply within Workday by searching for Find UT Jobs. If you are a current University employee, log-in to Workday, navigate to your Worker Profile, click the Career link in the left hand navigation menu and then update the sections in your Professional Profile before you apply. This information will be pulled in to your application. The application is one page and you will be prompted to upload your resume. In addition, you must respond to the application questions presented to upload any additional Required Materials (letter of interest, references, etc.) that were noted above.

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Employment Eligibility:

Regular staff who have been employed in their current position for the last six continuous months are eligible for openings being recruited for through University-Wide or Open Recruiting, to include both promotional opportunities and lateral transfers. Staff who are promotion/transfer eligible may apply for positions without supervisor approval.

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Retirement Plan Eligibility:

The retirement plan for this position is Teacher Retirement System of Texas (TRS), subject to the position being at least 20 hours per week and at least 135 days in length. This position has the option to elect the Optional Retirement Program (ORP) instead of TRS, subject to the position being 40 hours per week and at least 135 days in length.

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Background Checks:

A criminal history background check will be required for finalist(s) under consideration for this position.

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