Backend developer • el monte ca
The Backend Process Engineer –InPWafer Fab positionis responsible fordevelopment, optimization, and manufacturing support of backend wafer fabrication processes for Indium Phosphide (InP)–based pho... Show more
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The average salary range is between $ 107,092 and $ 148,115 year , with the average salary hovering around $ 126,532 year .
The average salary range is between $ 106,502 and $ 156,769 year , with the average salary hovering around $ 125,000 year .
Location:Alhambra, CA
Position Summary:The Backend Process Engineer –InPWafer Fab positionis responsible fordevelopment, optimization, and manufacturing support of backend wafer fabrication processes for Indium Phosphide (InP)–based photonic devices, including DFB lasers, Semiconductor Optical Amplifiers (SOAs), and Gain Chip products. This role provides technical ownership of critical backend modules including wafer lapping/thinning, n-side metallization, rapid thermal annealing (RTA),andautomated optical inspection (AOI). The position also supports singulation, optical coatings, reliability readiness, and packaging interfaces, with a strong focus on yield, defect reduction, and manufacturing stability.
Responsibilities:
Backend Process Ownership and Optimization (35%):
Own andoptimizebackend waferfabprocesses including lapping/thinning, n-side metallization, and RTA
Establish robust process windows, recipes, and control limits for backend modules
Maintain stable manufacturing performance through continuous monitoring and improvement
Yield Improvement, Defect Reduction, and AOI Control (25%):
Own and maintain AOI processes for backend defect detection and yield monitoring
Drive singulation yield improvement and defect reduction through data analysis and root-cause investigations
Analyze inline and post-process data toidentifytrends and systematic issues
Implement corrective and preventive actions and verify effectiveness
Singulation,OpticalCoatings, and Packaging Interface Support (20%):
Support cleaving, dicing, and singulation processes to ensure device integrity
Provide process engineering support for AR/HR optical coatings and vendor qualifications
Collaborate with packaging, device, and reliability teams to ensure packaging readiness
New Product Introduction and Technology Support (10%):
Support new product introduction (NPI), process transfers, and technology changes
Evaluate backend process risks associated withnew designs, materials, and device structures
Documentation, Process Control, and Manufacturing Support (10%)
Author andmaintainSOPs, travelers, process specifications, and control plans
Define SPC metrics and control strategies for backend processes
Provide hands-on manufacturing and troubleshooting support as needed
Minimum Qualifications:
Bachelor’s degree or higher in Chemical Engineering, Materials Science, Electrical Engineering, Physics, or a related field
Minimum of 3+ years of experience inbackend semiconductor processing
Hands-on experience with lapping/thinning, metallization, and thermal processes
Understanding ofInP-based or III-V compound semiconductor wafer fabrication processes
Experience with AOI systems, yield analysis, and data-driven process improvement
Strong understanding of singulation, packaging interfaces, and reliability requirements
Proficiencyin SPC, DOE, and statistical analysis
Ability to work across cross-functional manufacturing and engineering teams
Preferred experience withInPor III-V optoelectronic devices
Familiarity with AR/HR optical coating processes
Experience supporting high-mix, low-volume manufacturing environments preferred
A reasonable estimate of the pay range for this position is $100,000 - $135,000. There are several factors taken into consideration indeterminingbase salary, including but not limited to: job-related qualifications, skills,educationand experience, as well as job location and the value of other elements of an employee’s total compensation package.
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